H05K 3/046
By selective transfer or selective detachment of a conductive layer
Official title: {by selective transfer or selective detachment of a conductive layer}
H05K3/046 (By selective transfer or selective detachment of a conductive layer) appears on 414 US grants and 371 published applications in this corpus.
Search patents in H05K- Granted patents
- 414
- Published applications
- 371
- Assignees
- 263
- Inventors
- 992
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 5 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 10 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 6 | 0 |
| 1989 | 13 | 0 |
| 1990 | 7 | 0 |
| 1991 | 6 | 0 |
| 1992 | 5 | 0 |
| 1993 | 7 | 0 |
| 1994 | 5 | 0 |
| 1995 | 6 | 0 |
| 1996 | 4 | 0 |
| 1997 | 6 | 0 |
| 1998 | 11 | 0 |
| 1999 | 8 | 0 |
| 2000 | 14 | 0 |
| 2001 | 19 | 6 |
| 2002 | 13 | 18 |
| 2003 | 10 | 12 |
| 2004 | 12 | 15 |
| 2005 | 10 | 27 |
| 2006 | 10 | 23 |
| 2007 | 7 | 27 |
| 2008 | 14 | 29 |
| 2009 | 8 | 26 |
| 2010 | 22 | 21 |
| 2011 | 13 | 19 |
| 2012 | 6 | 16 |
| 2013 | 7 | 6 |
| 2014 | 11 | 7 |
| 2015 | 16 | 12 |
| 2016 | 7 | 9 |
| 2017 | 7 | 11 |
| 2018 | 11 | 11 |
| 2019 | 13 | 10 |
| 2020 | 11 | 18 |
| 2021 | 15 | 15 |
| 2022 | 12 | 7 |
| 2023 | 6 | 9 |
| 2024 | 9 | 7 |
| 2025 | 6 | 7 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Methods of forming interconnect circuits methods15 Sep 2026US 12,739,982 B2CelLink Corporation
- Silver nanowire thin-film patterning method25 Aug 2026US 12,721,113 B2Seoul National University R&Db Foundation
- Method for producing wiring board25 Aug 2026US 12,721,211 B2Mitsui Kinzoku Company, Limited
- Systems for printing viscous materials using laser assisted deposition23 Sep 2025US 12,420,479 B2Reophotonics, Ltd.
- Transferring viscous materials9 Sep 2025US 12,414,241 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Deposition apparatus, method for depositing, method for packaging a die in a chip package30 Jul 2026US 2026/0218369 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Manufacturing method of circuit board12 Mar 2026US 2026/0075720 A1Unimicron Technology Corp.
- Manufacturing of electric circuits on insulating coatings22 Jan 2026US 2026/0025929 A1Oerlikon Am Europe GmbH
- Component carrier and method for manufacturing a component carrier12 Jun 2025US 2025/0194018 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Apparatus for transferring a material8 May 2025US 2025/0144874 A1Granat Research, Ltd.
Most cited
By later US patents
- Patterned metal foil laminate and method for making same201US 5,759,422 AFort James Corporation · 1998
- Thermal transfer element for forming multilayer devices160US 6,114,088 A3M Innovative Properties Company · 2000
- Thermal transfer element and process for forming organic electroluminescent devices148US 6,194,119 B13M Innovative Properties Company · 2001
- Process for manufacturing printed circuit boards132US 6,004,619 AHewlett-Packard Company · 1999
- Method for the production of printed circuit boards125US 6,035,527 AIngenieurbuero Tamm Factory Innovations · 2000