H05K 3/048
Using a lift-off resist pattern or a release layer pattern
Official title: {using a lift-off resist pattern or a release layer pattern}
H05K3/048 (Using a lift-off resist pattern or a release layer pattern) appears on 208 US grants and 182 published applications in this corpus.
Search patents in H05K- Granted patents
- 208
- Published applications
- 182
- Assignees
- 151
- Inventors
- 557
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 9 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 7 | 0 |
| 2000 | 9 | 0 |
| 2001 | 8 | 3 |
| 2002 | 4 | 5 |
| 2003 | 2 | 6 |
| 2004 | 5 | 8 |
| 2005 | 5 | 15 |
| 2006 | 1 | 12 |
| 2007 | 6 | 13 |
| 2008 | 10 | 14 |
| 2009 | 4 | 11 |
| 2010 | 7 | 8 |
| 2011 | 6 | 10 |
| 2012 | 4 | 11 |
| 2013 | 4 | 4 |
| 2014 | 7 | 6 |
| 2015 | 10 | 6 |
| 2016 | 7 | 6 |
| 2017 | 7 | 8 |
| 2018 | 6 | 4 |
| 2019 | 5 | 5 |
| 2020 | 7 | 10 |
| 2021 | 5 | 3 |
| 2022 | 2 | 1 |
| 2023 | 3 | 6 |
| 2024 | 3 | 3 |
| 2025 | 3 | 4 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Process for manufacturing printed circuit boards132US 6,004,619 AHewlett-Packard Company · 1999
- Method for the production of printed circuit boards125US 6,035,527 AIngenieurbuero Tamm Factory Innovations · 2000
- Method of providing electrical interconnect between two layers within a silicon substrate, semiconductor apparatus, and method of forming apparatus for testing semiconductor circuitry for operability114US 5,419,807 AMicron Technology, Inc. · 1995
- Transparent conductors comprising metal nanowires112US 8,049,333 B2Cambrios Technologies Corporation · 2011
- Electrically conductive projections and semiconductor processing method of forming same89US 5,478,779 AMicron Technology, Inc. · 1995