Method for manufacturing wiring board, wiring board, method for manufacturing molded object, molded object
AssigneeFujikura Ltd.
InventorKazutoshi Koshimizu
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a wiring board includes: disposing a first resist material on a substrate; forming a first resist layer by curing the first resist material; forming a resin layer on a release film; forming a conductor portion on the resin layer; covering the conductor portion by disposing a second resist material on the resin layer; forming a second resist layer by curing the second resist material; bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding; and releasing the release film from the resin layer.
Claims7
A method for manufacturing a wiring board, comprising:
- disposing a first resist material on a substrate;
- forming a first resist layer by curing the first resist material;
- forming a resin layer on a release film;
- forming a conductor portion on the resin layer;
- covering the conductor portion by disposing a second resist material on the resin layer;
- forming a second resist layer by curing the second resist material;
- bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding;
- and
- releasing the release film from the resin layer, wherein
- the conductor portion comprises:
- a first conductor portion;
- and
- a second conductor portion,
- the wiring board comprises an insulation layer interposed between the first and second conductor portions, and
- the forming of the conductor portion on the resin layer comprises:
- forming the second conductor portion on the resin layer;
- forming the insulation layer on at least a part of the second conductor portion;
- and
- forming the first conductor portion on both of the resin layer and the insulation layer.
A method for manufacturing a wiring board, comprising:
- disposing a first resist material on a substrate;
- forming a resin layer on a release film;
- forming a conductor portion on the resin layer;
- covering the conductor portion by disposing a second resist material on the resin layer;
- bringing the first resist material into contact with the second resist material, and thereafter forming a first resist layer and a second resist layer by respectively curing the first resist material and the second resist material;
- and
- releasing the release film from the resin layer, wherein
- the conductor portion comprises:
- a first conductor portion;
- and
- a second conductor portion,
- the wiring board comprises an insulation layer interposed between the first and second conductor portions, and
- the forming of the conductor portion on the resin layer comprises:
- forming the second conductor portion on the resin layer;
- forming the insulation layer on at least a part of the second conductor portion;
- and
- forming the first conductor portion on both of the resin layer and the insulation layer.
Dependencies are inferred from the claim text.