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US 2024/0260200 A1Published application
Metal foil with carrier foil, laminate for printed wiring board using same, and manufacturing method for laminate
AssigneeYmt Co., Ltd.
InventorsSung Wook CHUN, Bo Mook CHUNG, Myong Whan PARK
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Abstract
The present invention relates to a carrier foil-attached metal foil, a laminate for a printed wiring board manufactured using the carrier foil-attached metal foil, and a manufacturing method of the laminate for the printed wiring board.
Claims9
A carrier foil-attached metal foil comprising:
- a carrier foil;
- a release layer provided on the carrier foil and comprising at least one selected from the group consisting of titanium, copper, nickel and aluminum;
- and
- a metal layer provided on the release layer and formed by electroless plating.
1 more element
A laminate for a printed wiring board comprising:
- a carrier foil;
- a release layer provided on the carrier foil and comprising at least one selected from the group consisting of titanium, copper, nickel and aluminum;
- a metal layer provided on the release layer and formed by electroless plating;
- and
- a resin layer provided on the metal layer.
2 more elements
A manufacturing method of a laminate for a printed wiring board comprising:
- preparing a carrier foil;
- forming a release layer comprising at least one selected from the group consisting of titanium, copper, nickel and aluminum on the carrier foil;
- forming a metal layer on the release layer by electroless plating;
- forming a resin layer by laminating a resin substrate on the metal layer, and pressing the resin layer to bond with the metal layer.
1 more element
Dependencies are inferred from the claim text.