H05K 3/041
By using a die for cutting the conductive material
Official title: {by using a die for cutting the conductive material}
H05K3/041 (By using a die for cutting the conductive material) appears on 108 US grants and 74 published applications in this corpus.
Search patents in H05K- Granted patents
- 108
- Published applications
- 74
- Assignees
- 71
- Inventors
- 182
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 2 |
| 2002 | 3 | 3 |
| 2003 | 1 | 8 |
| 2004 | 4 | 4 |
| 2005 | 2 | 3 |
| 2006 | 5 | 3 |
| 2007 | 4 | 10 |
| 2008 | 2 | 7 |
| 2009 | 2 | 2 |
| 2010 | 6 | 7 |
| 2011 | 5 | 6 |
| 2012 | 8 | 3 |
| 2013 | 2 | 1 |
| 2014 | 2 | 1 |
| 2015 | 0 | 0 |
| 2016 | 2 | 1 |
| 2017 | 0 | 1 |
| 2018 | 1 | 1 |
| 2019 | 3 | 0 |
| 2020 | 2 | 0 |
| 2021 | 5 | 5 |
| 2022 | 2 | 0 |
| 2023 | 0 | 2 |
| 2024 | 1 | 1 |
| 2025 | 0 | 0 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Tape processing method6 Oct 2026US 12,757,333 B2Chipbond Technology Corporation
- Method and structure for alignment of lens to optical product at PCBA level9 Jun 2026US 12,652,754 B2Pixart Imaging Inc.
- Method and structure for alignment of lens to optical product at PCBA level9 Apr 2024US 11,956,892 B2Pixart Imaging Inc.
- Reel-to-reel lamination methods and devices in FPC fabrication29 Nov 2022US 11,516,921 B2Manaflex, LLC
- Reel-to-reel laser ablation methods and devices in FPC fabrication1 Nov 2022US 11,490,523 B2
- Circuit and Fuse Fabrication Process for Flexible Printed Circuit Board (FPCB)14 May 2026US 2026/0136471 A1Guangzhou Amphenol Sincere Flex Circuits Co., Ltd
- Flexible die-cut circuit board and method of manufacturing same30 Apr 2026US 2026/0122777 A1SK On Co., Ltd.
- Tape and manufacturing method thereof5 Mar 2026US 2026/0068058 A1Chipbond Technology Corporation
- Method and structure for alignment of lens to optical product at pcba level20 Jun 2024US 2024/0206052 A1Pixart Imaging Inc.
- Tape and manufacturing method thereof23 Nov 2023US 2023/0380072 A1Chipbond Technology Corporation
Most cited
By later US patents
- Method of patterning a metal layer115US 6,165,911 A2000
- Circuit-like metallic foil sheet and the like and process for producing them112US 5,645,932 AKabushiki Kaisha Miyake · 1997
- Method of producing labels each having a circuit forming an oscillating circuit73US 4,900,386 ADurgo AG · 1990
- Patterned array of metal balls and methods of making69US 6,000,603 A3M Innovative Properties Company · 1999
- Radio frequency (RF) antenna containing element and methods of making the same61US 8,786,510 B2Avery Dennison Corporation · 2014