Circuit and Fuse Fabrication Process for Flexible Printed Circuit Board (FPCB)

A circuit and fuse fabrication process for a flexible printed circuit board (FPCB), comprising the following steps:

• S1:
• pressing and bonding, by an upper rubber roller and a lower steel roller, a release film featuring an original film with a thickness of 0.02-0.08 mm, a release adhesive with a thickness of 0.001-0.005 mm, and a peeling force of 1-10 G onto a bottom of a first polyethylene terephthalate (PET) silicone film featuring an original film with a thickness of 0.06-0.08 mm, an adhesive with a thickness of 0.01-0.03 mm, and a peeling force of 600-1,000 G;
• S2:
• removing, based on a position to retain a circuit and a fuse on a metal foil with a thickness of 0.03-0.12 mm, the release film at a circuit and fuse alignment position at the bottom of the first PET silicone film through a lower circular knife die, wherein a width of the removed release film is 0.1-0.2 mm larger than a width of the circuit and the fuse;
• and retaining the release film located outside the circuit and fuse alignment position;
• S3:
• aligning, based on the position to retain the circuit and the fuse on the metal foil, the position of the first PET silicone film where the release film is removed;
• pressing and bonding, by the upper rubber roller and the lower steel roller, the metal foil onto a release film side of the first PET silicone film;
• and cutting, by the lower circular knife die, to form the circuit and the fuse;
• and
• S4:
• bonding a second PET silicone film onto a bottom of the metal foil after cutting to form the circuit and the fuse;
• removing the second PET silicone film at the bottom of the metal foil and a metal foil waste;
• and retaining the circuit and fuse formed by cutting on the release film side of the first PET silicone film.