H05K 3/027
The conductive material being removed by irradiation
Official title: {the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles}
H05K3/027 (The conductive material being removed by irradiation) appears on 422 US grants and 394 published applications in this corpus.
Search patents in H05K- Granted patents
- 422
- Published applications
- 394
- Assignees
- 289
- Inventors
- 995
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 5 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 6 | 0 |
| 1988 | 3 | 0 |
| 1989 | 7 | 0 |
| 1990 | 7 | 0 |
| 1991 | 1 | 0 |
| 1992 | 6 | 0 |
| 1993 | 2 | 0 |
| 1994 | 10 | 0 |
| 1995 | 3 | 0 |
| 1996 | 10 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 4 | 0 |
| 2000 | 7 | 0 |
| 2001 | 8 | 5 |
| 2002 | 11 | 11 |
| 2003 | 13 | 11 |
| 2004 | 15 | 15 |
| 2005 | 6 | 10 |
| 2006 | 8 | 19 |
| 2007 | 9 | 17 |
| 2008 | 9 | 12 |
| 2009 | 6 | 19 |
| 2010 | 13 | 11 |
| 2011 | 8 | 8 |
| 2012 | 7 | 5 |
| 2013 | 11 | 22 |
| 2014 | 9 | 19 |
| 2015 | 12 | 32 |
| 2016 | 15 | 19 |
| 2017 | 14 | 13 |
| 2018 | 20 | 26 |
| 2019 | 23 | 21 |
| 2020 | 20 | 28 |
| 2021 | 34 | 25 |
| 2022 | 21 | 17 |
| 2023 | 11 | 8 |
| 2024 | 10 | 8 |
| 2025 | 10 | 6 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device and manufacturing method thereof8 Sep 2026US 12,733,523 B2Innolux Corporation
- Circuit board manufacturing method18 Aug 2026US 12,713,537 B2Ufab Corporation
- Circuit board having an edge containing conductive regions2 Jun 2026US 12,648,082 B2Teradyne, Inc.
- Method for manufacturing conductive circuit board26 May 2026US 12,641,731 B2Tong Hsing Electronic Industries, Ltd.
- Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks2 Sep 2025US 12,407,349 B2EKC Technology, Inc.
- Circuit board manufacturing system and method17 Sep 2026US 2026/0282242 A1Ufab Corporation
- Photosensitive resin composition, photosensitive element, printed wiring board, and method for manufacturing printed wiring board3 Sep 2026US 2026/0259499 A1
- Liquid crystal polymer dielectric powder or 3d printed material27 Aug 2026US 2026/0255492 A1LCP Medical Technologies, Inc.
- Laminate and method for manufacturing circuit board27 Aug 2026US 2026/0255493 A1Arisawa Mfg.Co., Ltd.
- Curable composition and insulating film11 Jun 2026US 2026/0159700 A1Dupont Electronics, Inc.
Most cited
By later US patents
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- Ultraviolet laser system and method for forming vias in multi-layered targets258US 5,593,606 AElectro Scientific Industries, Inc. · 1997
- Method of making a biosensor243US 7,073,246 B2Roche Diagnostics Operations, Inc. · 2006
- Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets146US 5,841,099 AElectro Scientific Industries, Inc. · 1998
- Laser system and method for plating vias141US 5,614,114 AElectro Scientific Industries, Inc. · 1997