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US 2026/0255493 A1Published application
Laminate and method for manufacturing circuit board
AssigneeArisawa Mfg. Co., Ltd.
InventorsEiji HIRAIWA, Naoki SUZUKI, Hiroyuki MATSUYAMA, Kenji NAKAMURA
Life of this patent
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Abstract
A laminate (10) includes a film (11), a resin layer (13) including a thermoplastic polyimide resin and being provided on at least one surface of the film, a catalyst layer (15) including palladium and a dispersant covering the palladium and being provided on the resin layer, and an electroless plating layer (17) including nickel and copper and being provided on the catalyst layer. A content of the nickel is 8.0 mass % or more and 13.0 mass % or less with respect to an entire mass of the electroless plating layer (17).
Claims6
A laminate comprising:
- a film;
- a resin layer including a thermoplastic polyimide resin and being provided on at least one surface of the film;
- a catalyst layer including palladium and a dispersant covering the palladium and being provided on the resin layer;
- and
- an electroless plating layer including nickel and copper and being provided on the catalyst layer,
- wherein a content of the nickel is 8.0 mass % or more and 13.0 mass % or less with respect to an entire mass of the electroless plating layer.
3 more elements
Dependencies are inferred from the claim text.