Method for manufacturing conductive circuit board

A method for manufacturing a conductive circuit board, comprising the steps of:

• (a) preparing a substrate, the substrate having an upper surface and a lower surface opposite to each other, and at least one through hole extending through the upper surface and the lower surface and defined by an inner surface;
• (b) forming a metal base layer on at least one of the upper surface and the lower surface of the substrate and on the inner surface;
• (c) etching the metal base layer formed on at least one of the upper surface and the lower surface of the substrate and on the inner surface by a laser beam, so that the at least one of the upper surface and the lower surface of the substrate and the inner surface are formed with a patterned metal base layer having a predetermined pattern for exposing a portion of the at least one of the upper surface and the lower surface of the substrate and a portion of the inner surface;
• and
• (d) forming a metal circuit layer on the at least one of the upper surface and the lower surface of the substrate and on the inner surface to increase a thickness of the patterned metal base layer formed on the at least one of the upper surface and the lower surface of the substrate and on the inner surface.