H05K 3/0008
Apparatus or processes for manufacturing printed circuits: for aligning or positioning of
Official title: {for aligning or positioning of tools relative to the circuit board (H05K3/4638, H05K3/4679 take precedence; for manufacturing assemblages of components H05K13/0015)}
H05K3/0008 (Apparatus or processes for manufacturing printed circuits: for aligning or positioning of) appears on 415 US grants and 417 published applications in this corpus.
Search patents in H05K- Granted patents
- 415
- Published applications
- 417
- Assignees
- 280
- Inventors
- 1,037
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 8 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 7 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 6 | 0 |
| 1997 | 7 | 0 |
| 1998 | 8 | 0 |
| 1999 | 3 | 0 |
| 2000 | 8 | 0 |
| 2001 | 15 | 13 |
| 2002 | 13 | 25 |
| 2003 | 21 | 23 |
| 2004 | 21 | 22 |
| 2005 | 9 | 26 |
| 2006 | 26 | 27 |
| 2007 | 9 | 16 |
| 2008 | 14 | 24 |
| 2009 | 6 | 25 |
| 2010 | 12 | 19 |
| 2011 | 12 | 18 |
| 2012 | 16 | 16 |
| 2013 | 11 | 13 |
| 2014 | 14 | 18 |
| 2015 | 12 | 15 |
| 2016 | 17 | 10 |
| 2017 | 16 | 10 |
| 2018 | 9 | 15 |
| 2019 | 12 | 6 |
| 2020 | 7 | 10 |
| 2021 | 6 | 13 |
| 2022 | 12 | 11 |
| 2023 | 12 | 11 |
| 2024 | 8 | 10 |
| 2025 | 8 | 11 |
| 2026 | 4 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Press-in machine for pressing components into a substrate, in particular into a printed circuit board or carrier plate, with substrate positioning11 Aug 2026US 12,707,617 B2ERSA GmbH
- Printing system and method for controlling printing system16 Jun 2026US 12,654,435 B2Illinois Tool Works Inc.
- Large area laser printing system and method17 Feb 2026US 12,552,179 B2Reophotonics, Ltd.
- Printed circuit board having cutting position identification mark and alignment mark and semiconductor package having the same17 Feb 2026US 12,557,209 B2Samsung Electronics Co., Ltd.
- Support pin for supporting a substrate in a placement area of a placement machine18 Nov 2025US 12,477,710 B2ASMPT GmbH & Co. KG
- Circuit board processing equipment8 Oct 2026US 2026/0313808 A1Wistron Corporation
- Electrically connecting a flexible circuit to a support structure27 Aug 2026US 2026/0255501 A1Teradyne, Inc.
- Precision alignment features for high density interconnects16 Jul 2026US 2026/0206605 A1Raytheon Company
- Pattern recognition system and method for digital printed circuit board assembly9 Jul 2026US 2026/0197945 A1National Technical University of Athens
- Separating machine for separating individual printed circuit boards from a printed circuit board panel, and method18 Jun 2026US 2026/0173276 A1Schunk Electronic Solutions GmbH
Most cited
By later US patents
- Laser beam scanning method for forming via holes in polymer materials168US 4,894,115 AGeneral Electric Company · 1990
- Printed circuit board through hole technique143US 4,964,948 AProtoCAD, Inc. · 1990
- High speed, high accuracy multi-stage tool positioning system143US 5,751,585 AElectro Scientific Industries, Inc. · 1998
- Blind via laser drilling system115US 6,211,485 B12001
- Device for aligning printed circuit boards and pattern carriers95US 5,566,840 AMultiline International Europa L.P. · 1996