H05K 3/0005
Apparatus or processes for manufacturing printed circuits: for designing circuits by computer
Official title: {for designing circuits by computer}
H05K3/0005 (Apparatus or processes for manufacturing printed circuits: for designing circuits by computer) appears on 524 US grants and 618 published applications in this corpus.
Search patents in H05K- Granted patents
- 524
- Published applications
- 618
- Assignees
- 258
- Inventors
- 1,171
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 8 | 0 |
| 1997 | 6 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 1 | 0 |
| 2001 | 9 | 5 |
| 2002 | 5 | 14 |
| 2003 | 17 | 17 |
| 2004 | 15 | 23 |
| 2005 | 17 | 23 |
| 2006 | 17 | 30 |
| 2007 | 25 | 23 |
| 2008 | 21 | 28 |
| 2009 | 11 | 39 |
| 2010 | 24 | 33 |
| 2011 | 24 | 19 |
| 2012 | 29 | 15 |
| 2013 | 13 | 10 |
| 2014 | 16 | 71 |
| 2015 | 29 | 25 |
| 2016 | 23 | 42 |
| 2017 | 22 | 30 |
| 2018 | 24 | 18 |
| 2019 | 20 | 22 |
| 2020 | 30 | 32 |
| 2021 | 21 | 16 |
| 2022 | 21 | 27 |
| 2023 | 20 | 16 |
| 2024 | 14 | 19 |
| 2025 | 11 | 9 |
| 2026 | 7 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor substrate, method for designing semiconductor substrate, and apparatus for manufacturing semiconductor substrate25 Aug 2026US 12,720,670 B2NEC Corporation
- Systems and methods for automated degassing during the manufacturing of a high speed design23 Jun 2026US 12,666,538 B2Advanced Micro Devices, Inc.
- Modular routable circuit board conductor blocks16 Jun 2026US 12,660,095 B2Microsoft Technology Licensing, LLC
- Vehicle systems configured to interact with remotely located smart systems26 May 2026US 12,639,378 B2
- Generation of random security circuit patterns for in-situ fabrication of tamper-respondent sensors17 Mar 2026US 12,581,600 B2International Business Machines Corporation
- Overlapped interconnect with enhanced design1 Oct 2026US 2026/0304601 A1Micron Technology, Inc.
- Component Carrier and Method of Designing and Manufacturing a Component Carrier1 Oct 2026US 2026/0305412 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Vehicles including split-bus architectures3 Sep 2026US 2026/0259945 A1AutoConnect Holdings LLC
- Pcb signal via structure and determination method, determination apparatus, and determination device for pcb signal via structure3 Sep 2026US 2026/0262164 A1Suzhou Metabrain Intelligent Technology Co., Ltd.
- Device for forming resin laminate, circuit board, and method for forming circuit board20 Aug 2026US 2026/0247538 A1Fuji Corporation
Most cited
By later US patents
- Automatic communication of damage and health in detected vehicle incidents270US 9,317,983 B2AutoConnect Holdings LLC · 2016
- Method of determining routes for a plurality of wiring connections and a circuit board produced by such a method112US 5,657,242 AHitachi, Ltd. · 1997
- Method for creating, modifying, and simulating electrical circuits over the internet103US 7,441,219 B2National Semiconductor Corporation · 2008
- Vehicle damage detection and indication100US 9,218,698 B2AutoConnect Holdings LLC · 2015
- Method and CAD system for designing wiring patterns using predetermined rules98US 5,634,093 AKabushiki Kaisha Toshiba · 1997