H05K 3/30
Assembling printed circuits with electric components
Official title: Assembling printed circuits with electric components, e.g. with resistors
H05K3/30 (Assembling printed circuits with electric components) appears on 21,754 US grants and 18,995 published applications in this corpus.
Search patents in H05K- Granted patents
- 21,754
- Published applications
- 18,995
- Assignees
- 4,627
- Inventors
- 36,538
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 47 | 0 |
| 1977 | 56 | 0 |
| 1978 | 69 | 0 |
| 1979 | 48 | 0 |
| 1980 | 58 | 0 |
| 1981 | 57 | 0 |
| 1982 | 72 | 0 |
| 1983 | 97 | 0 |
| 1984 | 90 | 0 |
| 1985 | 132 | 0 |
| 1986 | 171 | 0 |
| 1987 | 197 | 0 |
| 1988 | 200 | 0 |
| 1989 | 228 | 0 |
| 1990 | 249 | 0 |
| 1991 | 313 | 0 |
| 1992 | 280 | 0 |
| 1993 | 256 | 0 |
| 1994 | 304 | 0 |
| 1995 | 340 | 0 |
| 1996 | 348 | 0 |
| 1997 | 365 | 0 |
| 1998 | 537 | 0 |
| 1999 | 615 | 0 |
| 2000 | 652 | 0 |
| 2001 | 776 | 344 |
| 2002 | 782 | 804 |
| 2003 | 778 | 859 |
| 2004 | 728 | 842 |
| 2005 | 588 | 882 |
| 2006 | 589 | 902 |
| 2007 | 544 | 949 |
| 2008 | 508 | 944 |
| 2009 | 542 | 1061 |
| 2010 | 682 | 830 |
| 2011 | 613 | 663 |
| 2012 | 667 | 603 |
| 2013 | 525 | 611 |
| 2014 | 478 | 826 |
| 2015 | 605 | 891 |
| 2016 | 694 | 786 |
| 2017 | 746 | 680 |
| 2018 | 716 | 732 |
| 2019 | 766 | 750 |
| 2020 | 739 | 779 |
| 2021 | 601 | 683 |
| 2022 | 549 | 635 |
| 2023 | 543 | 603 |
| 2024 | 502 | 528 |
| 2025 | 461 | 379 |
| 2026 | 251 | 429 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Sealed squeegee for supplying solder paste with uniform density6 Oct 2026US 12,752,358 B2Ese Co., Ltd.
- Ground connection for automotive shielded cables6 Oct 2026US 12,756,119 B1Infineon Technologies Americas Corp.
- Technologies for reducing the impact of radiofrequency interference on a circuit board6 Oct 2026US 12,757,317 B2Intel Corporation
- Relay circuit board29 Sep 2026US 12,749,639 B2Avary Holding (Shenzhen) Co., Limited.
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Camera module8 Oct 2026US 2026/0309956 A1LG Innotek Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313794 A1Samsung Electro-Mechanics Co., Ltd.
- Power modules with vertical power flow8 Oct 2026US 2026/0313799 A1Analog Devices International Unlimited Company
- Power module and method for manufacturing the same, and power conversion apparatus8 Oct 2026US 2026/0313805 A1Mitsubishi Electric Corporation
- Method of forming an electronic assembly having a conformal coating, electronic assembly and film precursor to conformal coating8 Oct 2026US 2026/0313811 A1
Most cited
By later US patents
- Programmer1,483US 4,213,562 A1980
- Oximeter sensor assembly with integral cable1,236US 4,964,408 AThor Technology Corporation · 1990
- Oximeter sensor assembly with integral cable and encoder1,015US 5,069,213 AThor Technology Corporation · 1991
- Oximeter sensor assembly with integral cable and method of forming the same965US 5,041,187 AThor Technology Corporation · 1991
- Flex circuit connector916US 5,482,473 AMiniMed Inc. · 1996