Power module and method for manufacturing the same, and power conversion apparatus
AssigneeMitsubishi Electric Corporation
InventorYusaku ITO
Life of this patent
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Abstract
A power module comprises a circuit board, a semiconductor device, a terminal, and a conductive connection member. The circuit board includes an insulating layer having a major surface, and a conductive circuit pattern provided on the major surface. The semiconductor device is joined to the conductive circuit pattern. The conductive circuit pattern includes a conductive pattern. The terminal includes a first end. The first end of the terminal includes a first surface joined to the conductive pattern and a second surface opposite to the first surface. The conductive connection member bridges the second surface of the terminal and the conductive pattern.
Claims8
A power module comprising:
- a circuit board including an insulating layer having a major surface, and a conductive circuit pattern provided on the major surface;
- a semiconductor device joined to the conductive circuit pattern;
- a terminal including a first end;
- and
- a first conductive connection member,
- the conductive circuit pattern including a first conductive pattern,
- the first end of the terminal including a first surface joined to the first conductive pattern and a second surface opposite to the first surface,
- the first conductive connection member bridging the second surface and the first conductive pattern.
A method for manufacturing a power module, comprising:
- preparing a circuit board including an insulating layer having a major surface, and a conductive circuit pattern provided on the major surface, the conductive circuit pattern including a first conductive pattern;
- joining a semiconductor device to the conductive circuit pattern;
- joining a terminal to the first conductive pattern, the terminal including a first end, the first end of the terminal including a first surface joined to the first conductive pattern and a second surface opposite the first surface;
- and
- bridging the second surface and the first conductive pattern with a first conductive connection member.
Dependencies are inferred from the claim text.