H05K 3/32
Electrically connecting electric components or wires to printed circuits
Official title: electrically connecting electric components or wires to printed circuits
H05K3/32 (Electrically connecting electric components or wires to printed circuits) appears on 18,438 US grants and 16,060 published applications in this corpus.
Search patents in H05K- Granted patents
- 18,438
- Published applications
- 16,060
- Assignees
- 3,994
- Inventors
- 31,273
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 41 | 0 |
| 1977 | 50 | 0 |
| 1978 | 56 | 0 |
| 1979 | 40 | 0 |
| 1980 | 48 | 0 |
| 1981 | 48 | 0 |
| 1982 | 59 | 0 |
| 1983 | 83 | 0 |
| 1984 | 69 | 0 |
| 1985 | 104 | 0 |
| 1986 | 146 | 0 |
| 1987 | 172 | 0 |
| 1988 | 166 | 0 |
| 1989 | 196 | 0 |
| 1990 | 212 | 0 |
| 1991 | 264 | 0 |
| 1992 | 240 | 0 |
| 1993 | 228 | 0 |
| 1994 | 270 | 0 |
| 1995 | 303 | 0 |
| 1996 | 306 | 0 |
| 1997 | 324 | 0 |
| 1998 | 480 | 0 |
| 1999 | 536 | 0 |
| 2000 | 575 | 0 |
| 2001 | 687 | 308 |
| 2002 | 689 | 709 |
| 2003 | 682 | 752 |
| 2004 | 644 | 742 |
| 2005 | 515 | 799 |
| 2006 | 516 | 801 |
| 2007 | 481 | 857 |
| 2008 | 459 | 817 |
| 2009 | 480 | 933 |
| 2010 | 594 | 709 |
| 2011 | 532 | 575 |
| 2012 | 584 | 521 |
| 2013 | 432 | 492 |
| 2014 | 404 | 636 |
| 2015 | 497 | 700 |
| 2016 | 544 | 611 |
| 2017 | 584 | 544 |
| 2018 | 556 | 587 |
| 2019 | 587 | 600 |
| 2020 | 595 | 636 |
| 2021 | 474 | 575 |
| 2022 | 450 | 535 |
| 2023 | 455 | 494 |
| 2024 | 397 | 441 |
| 2025 | 377 | 321 |
| 2026 | 207 | 365 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Sealed squeegee for supplying solder paste with uniform density6 Oct 2026US 12,752,358 B2Ese Co., Ltd.
- Ground connection for automotive shielded cables6 Oct 2026US 12,756,119 B1Infineon Technologies Americas Corp.
- Technologies for reducing the impact of radiofrequency interference on a circuit board6 Oct 2026US 12,757,317 B2Intel Corporation
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Electronic device29 Sep 2026US 12,750,946 B2Kmw Inc.
- Printed circuit board8 Oct 2026US 2026/0313794 A1Samsung Electro-Mechanics Co., Ltd.
- Power module and method for manufacturing the same, and power conversion apparatus8 Oct 2026US 2026/0313805 A1Mitsubishi Electric Corporation
- Method of forming an electronic assembly having a conformal coating, electronic assembly and film precursor to conformal coating8 Oct 2026US 2026/0313811 A1
- Modular Flight Management System Incorporating An Autopilot1 Oct 2026US 2026/0300466 A1Skydio, Inc.
- Component Carrier With Electronic Component and Thick Thermally Conductive Layers on Both Sides1 Oct 2026US 2026/0304632 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Programmer1,483US 4,213,562 A1980
- Oximeter sensor assembly with integral cable1,236US 4,964,408 AThor Technology Corporation · 1990
- Oximeter sensor assembly with integral cable and encoder1,015US 5,069,213 AThor Technology Corporation · 1991
- Oximeter sensor assembly with integral cable and method of forming the same965US 5,041,187 AThor Technology Corporation · 1991
- Flex circuit connector916US 5,482,473 AMiniMed Inc. · 1996