H05K 3/34
By soldering
Official title: by soldering
H05K3/34 (By soldering) appears on 13,316 US grants and 11,552 published applications in this corpus.
Search patents in H05K- Granted patents
- 13,316
- Published applications
- 11,552
- Assignees
- 3,033
- Inventors
- 23,318
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 28 | 0 |
| 1977 | 39 | 0 |
| 1978 | 45 | 0 |
| 1979 | 30 | 0 |
| 1980 | 31 | 0 |
| 1981 | 35 | 0 |
| 1982 | 49 | 0 |
| 1983 | 61 | 0 |
| 1984 | 53 | 0 |
| 1985 | 78 | 0 |
| 1986 | 108 | 0 |
| 1987 | 127 | 0 |
| 1988 | 126 | 0 |
| 1989 | 157 | 0 |
| 1990 | 161 | 0 |
| 1991 | 191 | 0 |
| 1992 | 165 | 0 |
| 1993 | 165 | 0 |
| 1994 | 187 | 0 |
| 1995 | 225 | 0 |
| 1996 | 234 | 0 |
| 1997 | 239 | 0 |
| 1998 | 344 | 0 |
| 1999 | 423 | 0 |
| 2000 | 433 | 0 |
| 2001 | 518 | 217 |
| 2002 | 511 | 510 |
| 2003 | 490 | 583 |
| 2004 | 490 | 570 |
| 2005 | 386 | 581 |
| 2006 | 370 | 590 |
| 2007 | 348 | 625 |
| 2008 | 336 | 614 |
| 2009 | 354 | 682 |
| 2010 | 442 | 498 |
| 2011 | 386 | 398 |
| 2012 | 410 | 365 |
| 2013 | 285 | 358 |
| 2014 | 281 | 454 |
| 2015 | 348 | 513 |
| 2016 | 395 | 422 |
| 2017 | 419 | 350 |
| 2018 | 369 | 408 |
| 2019 | 395 | 422 |
| 2020 | 412 | 431 |
| 2021 | 321 | 390 |
| 2022 | 301 | 371 |
| 2023 | 324 | 355 |
| 2024 | 281 | 321 |
| 2025 | 269 | 232 |
| 2026 | 141 | 292 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 3/341Surface mounted components7,509
- H05K 3/3465Application of solder3,260
- H05K 3/3447Lead-in-hole components1,466
- H05K 3/3452Solder masks1,445
- H05K 3/3494Heating processes for reflow soldering1,003
- H05K 3/346Solder materials or compositions specially adapted therefor747
- H05K 3/3405Edge mounted components635
- H05K 3/3489Composition of fluxes567
Recent patents
- Sealed squeegee for supplying solder paste with uniform density6 Oct 2026US 12,752,358 B2Ese Co., Ltd.
- Technologies for reducing the impact of radiofrequency interference on a circuit board6 Oct 2026US 12,757,317 B2Intel Corporation
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Printed circuit board8 Sep 2026US 12,733,094 B2Samsung Electro-Mechanics Co., Ltd.
- Selective removal of adhesive from coverlay for printed circuit board insulation25 Aug 2026US 12,720,671 B2Rockwell Collins, Inc.
- Printed circuit board8 Oct 2026US 2026/0313794 A1Samsung Electro-Mechanics Co., Ltd.
- Method of forming an electronic assembly having a conformal coating, electronic assembly and film precursor to conformal coating8 Oct 2026US 2026/0313811 A1
- Wiring board1 Oct 2026US 2026/0304634 A1Shinko Electric Industries Co., Ltd.
- Electronic device with multi-diameter female contacts and related methods1 Oct 2026US 2026/0304640 A1Eagle Technology, LLC
- Electronic package and method for forming the same1 Oct 2026US 2026/0304642 A1JCET STATS ChipPAC Korea Limited
Most cited
By later US patents
- Programmer1,483US 4,213,562 A1980
- Oximeter sensor assembly with integral cable1,236US 4,964,408 AThor Technology Corporation · 1990
- Oximeter sensor assembly with integral cable and encoder1,015US 5,069,213 AThor Technology Corporation · 1991
- Oximeter sensor assembly with integral cable and method of forming the same965US 5,041,187 AThor Technology Corporation · 1991
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013