H05K 3/341
Surface mounted components
H05K3/341 (Surface mounted components) appears on 7,509 US grants and 6,704 published applications in this corpus.
Search patents in H05K- Granted patents
- 7,509
- Published applications
- 6,704
- Assignees
- 1,881
- Inventors
- 13,893
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 12 | 0 |
| 1978 | 7 | 0 |
| 1979 | 10 | 0 |
| 1980 | 4 | 0 |
| 1981 | 5 | 0 |
| 1982 | 12 | 0 |
| 1983 | 18 | 0 |
| 1984 | 16 | 0 |
| 1985 | 32 | 0 |
| 1986 | 42 | 0 |
| 1987 | 50 | 0 |
| 1988 | 67 | 0 |
| 1989 | 63 | 0 |
| 1990 | 85 | 0 |
| 1991 | 93 | 0 |
| 1992 | 74 | 0 |
| 1993 | 74 | 0 |
| 1994 | 101 | 0 |
| 1995 | 130 | 0 |
| 1996 | 136 | 0 |
| 1997 | 138 | 0 |
| 1998 | 202 | 0 |
| 1999 | 253 | 0 |
| 2000 | 265 | 0 |
| 2001 | 325 | 118 |
| 2002 | 287 | 325 |
| 2003 | 298 | 358 |
| 2004 | 290 | 334 |
| 2005 | 236 | 358 |
| 2006 | 230 | 312 |
| 2007 | 221 | 327 |
| 2008 | 181 | 347 |
| 2009 | 182 | 351 |
| 2010 | 248 | 290 |
| 2011 | 215 | 228 |
| 2012 | 231 | 215 |
| 2013 | 161 | 191 |
| 2014 | 150 | 284 |
| 2015 | 206 | 307 |
| 2016 | 242 | 265 |
| 2017 | 254 | 214 |
| 2018 | 232 | 255 |
| 2019 | 255 | 245 |
| 2020 | 256 | 256 |
| 2021 | 190 | 204 |
| 2022 | 166 | 223 |
| 2023 | 166 | 203 |
| 2024 | 174 | 174 |
| 2025 | 148 | 120 |
| 2026 | 70 | 200 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Insulating circuit board and semiconductor device using same25 Aug 2026US 12,721,197 B2Niterra Materials Co., Ltd.
- Circuit board and semiconductor package having the same25 Aug 2026US 12,721,201 B2LG Innotek Co., Ltd.
- Single-layer printed circuit board for a lighting device18 Aug 2026US 12,710,144 B2Lutron Technology Company LLC
- Flexible printed circuit board18 Aug 2026US 12,713,522 B2Lisa Dräxlmaier GmbH
- Electronic package and method for forming the same1 Oct 2026US 2026/0304642 A1JCET STATS ChipPAC Korea Limited
- Vertical balun for differential-to-single ended transition of mm-wave signals1 Oct 2026US 2026/0305361 A1NXP B. V.
- Connection carrier, method for producing a solder joint and device24 Sep 2026US 2026/0292998 A1ams-OSRAM International GmbH
- Manufacturing method for component mounting substrate24 Sep 2026US 2026/0292999 A1Panasonic Intellectual Property Management Co., Ltd.
- Method and Apparatus for Stacking Printed Circuit Board Assemblies with Single Reflow24 Sep 2026US 2026/0293000 A1Jabil Inc.
Most cited
By later US patents
- Oximeter sensor assembly with integral cable1,236US 4,964,408 AThor Technology Corporation · 1990
- Oximeter sensor assembly with integral cable and encoder1,015US 5,069,213 AThor Technology Corporation · 1991
- Oximeter sensor assembly with integral cable and method of forming the same965US 5,041,187 AThor Technology Corporation · 1991
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997