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US 2026/0293000 A1Published application
Method and Apparatus for Stacking Printed Circuit Board Assemblies with Single Reflow
AssigneeJabil Inc.
InventorsZambri Bin Samsudin, Idris Bin Mansor
Life of this patent
Estimating the term…
Abstract
Disclosed herein are implementations of methods and devices for stacking printed circuit board (PCB) assemblies (PCBA) with a single reflow process which decreases impact on surface mount technology (SMT) component and solder joint reliability.
Claims20
A system for printed circuit board (PCB) assembly (PCBA) stacking with a
- single reflow, the system comprising:
- a pick and place machine configured to pick and place a top PCB, one or more middle PCBs, and a bottom PCB on a pick and place pallet;
- a deposition device configured to deposit solder paste on the top PCB, the one or more middle PCBs, and the bottom PCB nearly simultaneously after placement of the top PCB, the one or more middle PCBs, and the bottom PCB on the pick and place pallet;
- pick and place machine configured to:
- pick and place surface mount technology (SMT) components on the top PCB, the one or more middle PCBs, and the bottom PCB to form an un-reflowed top PCB, un-reflowed one or more middle PCBs, and an un-reflowed bottom PCB after nearly simultaneously deposition of the solder paste on the top PCB, the one or more middle PCBs, and the bottom PCB;
- and
- pick and place the un-reflowed top PCB and the un-reflowed one or more middle PCBs on the un-reflowed bottom PCB to form a stacked assembly after placement of the SMT components on all the top PCB, the one or more middle PCBs, and the bottom PCB;
- and
- a reflow oven configured to reflow the stacked assembly in a single reflow to form the PCBA.
6 more elements
A system for printed circuit board (PCB) assembly (PCBA) stacking with a
- single reflow, the system comprising:
- a pick and place machine configured to position a top PCB, one or more middle PCBs, and a motherboard PCB on a pick and place pallet;
- a deposition device configured to transfer solder paste on the top PCB, the one or more middle PCBs, and the motherboard PCB nearly simultaneously after placement of the top PCB, the one or more middle PCBs, and the motherboard PCB on the pick and place pallet;
- pick and place machine configured to:
- pick and place surface mount technology (SMT) components on the top PCB, the one or more middle PCBs, and the motherboard PCB to form an un-reflowed top PCB, un-reflowed one or more middle PCBs, and an un-reflowed motherboard PCB after nearly simultaneous transfer of the solder paste on the top PCB, the one or more middle PCBs, and the motherboard PCB;
- and
- stack the un-reflowed top PCB and the un-reflowed one or more middle PCBs on the un-reflowed motherboard PCB to form an un-reflowed stacked assembly after placement of the SMT components on all the top PCB, the one or more middle PCBs, and the motherboard PCB;
- and
- a reflow oven configured to reflow the un-reflowed stacked assembly in a single reflow to form a stacked PCBA.
6 more elements
Dependencies are inferred from the claim text.