H05K 3/3431
Leadless components
Official title: {Leadless components}
H05K3/3431 (Leadless components) appears on 4,651 US grants and 4,553 published applications in this corpus.
Search patents in H05K- Granted patents
- 4,651
- Published applications
- 4,553
- Assignees
- 1,156
- Inventors
- 8,923
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 6 | 0 |
| 1983 | 9 | 0 |
| 1984 | 8 | 0 |
| 1985 | 19 | 0 |
| 1986 | 14 | 0 |
| 1987 | 21 | 0 |
| 1988 | 20 | 0 |
| 1989 | 23 | 0 |
| 1990 | 27 | 0 |
| 1991 | 33 | 0 |
| 1992 | 22 | 0 |
| 1993 | 28 | 0 |
| 1994 | 39 | 0 |
| 1995 | 57 | 0 |
| 1996 | 64 | 0 |
| 1997 | 73 | 0 |
| 1998 | 113 | 0 |
| 1999 | 134 | 0 |
| 2000 | 165 | 0 |
| 2001 | 211 | 79 |
| 2002 | 182 | 218 |
| 2003 | 208 | 239 |
| 2004 | 189 | 218 |
| 2005 | 150 | 236 |
| 2006 | 142 | 208 |
| 2007 | 149 | 222 |
| 2008 | 113 | 214 |
| 2009 | 114 | 219 |
| 2010 | 167 | 181 |
| 2011 | 138 | 152 |
| 2012 | 133 | 145 |
| 2013 | 111 | 140 |
| 2014 | 109 | 214 |
| 2015 | 146 | 229 |
| 2016 | 175 | 188 |
| 2017 | 197 | 155 |
| 2018 | 154 | 169 |
| 2019 | 186 | 168 |
| 2020 | 174 | 165 |
| 2021 | 125 | 139 |
| 2022 | 113 | 154 |
| 2023 | 112 | 140 |
| 2024 | 129 | 114 |
| 2025 | 95 | 89 |
| 2026 | 45 | 158 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board and semiconductor package having the same25 Aug 2026US 12,721,201 B2LG Innotek Co., Ltd.
- Flexible printed circuit board18 Aug 2026US 12,713,522 B2Lisa Dräxlmaier GmbH
- Reinforcement structure and electronic device18 Aug 2026US 12,713,927 B2Huawei Technologies Co., Ltd.
- Transparent package for use with printed circuit boards14 Jul 2026US 12,684,689 B2Honeywell Federal Manufacturing & Technologies, LLC
- Semiconductor device package with wettable flanks14 Jul 2026US 12,685,207 B2Texas Instruments Incorporated
- Electronic package and method for forming the same1 Oct 2026US 2026/0304642 A1JCET STATS ChipPAC Korea Limited
- Circuit board, semiconductor device, and method for manufacturing semiconductor device27 Aug 2026US 2026/0255471 A1Kioxia Corporation
- Wiring board and method of manufacturing wiring board27 Aug 2026US 2026/0255491 A1Shinko Electric Industries Co., Ltd.
- Device and process for implementing silicon carbide (sic) surface mount devices20 Aug 2026US 2026/0245796 A1Wolfspeed, Inc.
- Manufacturing method for a mounting board and mounting board20 Aug 2026US 2026/0248020 A1Sony Semiconductor Solutions Corporation
Most cited
By later US patents
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Substrate for packaging a semiconductor device370US 5,214,308 ASumitomo Electric Industries, Ltd. · 1993
- Circuit structure including a passive element formed within a grid array substrate and method for making the same370US 6,362,525 B1Cypress Semiconductor Corporation · 2002