H05K 3/3442
Having edge contacts
Official title: {having edge contacts, e.g. leadless chip capacitors, chip carriers}
H05K3/3442 (Having edge contacts) appears on 1,453 US grants and 1,285 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,453
- Published applications
- 1,285
- Assignees
- 521
- Inventors
- 3,024
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 8 | 0 |
| 1984 | 8 | 0 |
| 1985 | 17 | 0 |
| 1986 | 11 | 0 |
| 1987 | 19 | 0 |
| 1988 | 13 | 0 |
| 1989 | 19 | 0 |
| 1990 | 16 | 0 |
| 1991 | 17 | 0 |
| 1992 | 5 | 0 |
| 1993 | 9 | 0 |
| 1994 | 18 | 0 |
| 1995 | 18 | 0 |
| 1996 | 23 | 0 |
| 1997 | 23 | 0 |
| 1998 | 33 | 0 |
| 1999 | 29 | 0 |
| 2000 | 47 | 0 |
| 2001 | 54 | 18 |
| 2002 | 42 | 57 |
| 2003 | 50 | 64 |
| 2004 | 53 | 50 |
| 2005 | 39 | 80 |
| 2006 | 43 | 65 |
| 2007 | 38 | 71 |
| 2008 | 37 | 75 |
| 2009 | 38 | 69 |
| 2010 | 54 | 47 |
| 2011 | 52 | 32 |
| 2012 | 31 | 26 |
| 2013 | 24 | 27 |
| 2014 | 23 | 69 |
| 2015 | 47 | 79 |
| 2016 | 58 | 57 |
| 2017 | 59 | 54 |
| 2018 | 52 | 48 |
| 2019 | 73 | 50 |
| 2020 | 55 | 48 |
| 2021 | 33 | 38 |
| 2022 | 33 | 44 |
| 2023 | 37 | 38 |
| 2024 | 44 | 36 |
| 2025 | 30 | 23 |
| 2026 | 10 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and semiconductor package having the same25 Aug 2026US 12,721,201 B2LG Innotek Co., Ltd.
- Flexible printed circuit board18 Aug 2026US 12,713,522 B2Lisa Dräxlmaier GmbH
- Surface mount electrical devices and methods23 Jun 2026US 12,665,155 B2Bourns, Inc.
- Electronic component mounting structure and method for manufacturing same26 May 2026US 12,641,733 B2Murata Manufacturing Co., Ltd.
- Device and process for implementing silicon carbide (SiC) surface mount devices5 May 2026US 12,620,530 B2Wolfspeed, Inc.
- Circuit board, semiconductor device, and method for manufacturing semiconductor device27 Aug 2026US 2026/0255471 A1Kioxia Corporation
- Device and process for implementing silicon carbide (sic) surface mount devices20 Aug 2026US 2026/0245796 A1Wolfspeed, Inc.
- Methods and apparatus to enable attachment of surface mount technology (smt) components of different sizes to an underlying substrate13 Aug 2026US 2026/0239532 A1Intel Corporation
- Substrate carrier and motor vehicle23 Jul 2026US 2026/0214788 A1Hella GmbH & Co. KGaA
- High-frequency electronic component23 Jul 2026US 2026/0214795 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Plated plastic castellated interconnect for electrical components301US 5,069,626 AWestern Digital Corporation · 1991
- Electronic part and a method of manufacturing the same236US 6,292,139 B1Murata Manufacturing Co., Ltd. · 2001
- Surface mount multilayer capacitor225US 5,880,925 AAVX Corporation · 1999
- Methods for assembling multiple semiconductor devices202US 7,198,980 B2Micron Technology, Inc. · 2007