Device and process for implementing silicon carbide (SiC) surface mount devices
AssigneeWolfspeed, Inc.
InventorsKok Meng Kam, Eng Wah Woo, Samantha Cheang, Marvin Marbell, Haedong Jang, Jeremy Fisher, Basim Noori
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Abstract
In some aspects, a device includes a substrate. A first metallization arranged on the substrate. A second metallization arranged on the substrate. A circuit arranged on the substrate and electrically connected to the first metallization and the second metallization. The first metallization and the second metallization being configured, structured, and arranged to make a solder connection to a device, where the substrate may include silicon carbide (SiC).
Claims32
A silicon carbide (SiC) surface mount device (SMD) comprising:
- a substrate comprising a first surface and a second surface opposite the first surface;
- a first metallization arranged on the first surface and the second surface of the substrate;
- a second metallization arranged on the first surface and the second surface of the substrate;
- a circuit arranged on the substrate and electrically connected to the first metallization and the second metallization;
- and
- the first metallization and the second metallization being configured, structured, and arranged to make a solder connection to a device,
- wherein the substrate comprises silicon carbide (SiC).
A process of implementing a silicon carbide (SiC) surface mount device (SMD) comprising:
- providing a substrate comprising a first surface and a second surface opposite the first surface;
- arranging a first metallization on the first surface and the second surface of the substrate;
- arranging a second metallization on the first surface and the second surface of the substrate;
- arranging a circuit electrically connected to the first metallization and the second metallization;
- and
- reflowing a solder to connect the first metallization and the second metallization to a device,
- wherein the substrate comprises silicon carbide (SiC).
A device comprising:
- a silicon carbide substrate comprising a first surface and a second surface opposite the first surface;
- a first metallization on the first surface and the second surface of the silicon carbide substrate
- a first via between the first surface and the second surface and electrically connecting the first metallization on the first surface and the second surface;
- a second metallization on the first surface and the second surface of the silicon carbide substrate;
- a second via between the first surface and the second surface and electrically connecting the second metallization on the first surface and the second surface
- a circuit on the first surface of the silicon carbide substrate and electrically connected to the first metallization and the second metallization;
- and
- a device substrate comprising a first solder connection with the first metallization and a second solder connection with the second metallization.
Dependencies are inferred from the claim text.