High-frequency electronic component

A high-frequency electronic component comprising:

• a multilayer substrate;
• ground electrodes provided at different layers of the multilayer substrate;
• and
• a shielding film covering at least a side surface among surfaces of the multilayer substrate,
• the multilayer substrate including a first main surface and a second main surface opposite to each other in a thickness direction of the multilayer substrate,
• the second main surface being a main surface to be a mounting surface,
• two or more of the ground electrodes being exposed to the side surface of the multilayer substrate and protruding from the side surface, and being electrically connected to the shielding film,
• on the side surface of the multilayer substrate, the two or more of the ground electrodes including a first ground electrode and a second ground electrode, the first ground electrode being provided at a layer closest to the first main surface among the layers provided with the respective ground electrodes and protruding from the side surface of the multilayer substrate, and the second ground electrode being provided at a layer next closest to the first main surface among the layers provided with the respective ground electrodes,
• the first ground electrode protruding from the side surface of the multilayer substrate at a maximum protruding amount of a (μm),
• in a side view of the multilayer substrate, a minimum distance between the first ground electrode and the second ground electrode being 30.5a+5 (μm) or greater.