H05K 3/3436
Having an array of bottom contacts
Official title: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
H05K3/3436 (Having an array of bottom contacts) appears on 3,037 US grants and 3,114 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,037
- Published applications
- 3,114
- Assignees
- 783
- Inventors
- 5,895
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 4 | 0 |
| 1990 | 9 | 0 |
| 1991 | 13 | 0 |
| 1992 | 16 | 0 |
| 1993 | 12 | 0 |
| 1994 | 17 | 0 |
| 1995 | 30 | 0 |
| 1996 | 43 | 0 |
| 1997 | 41 | 0 |
| 1998 | 70 | 0 |
| 1999 | 100 | 0 |
| 2000 | 118 | 0 |
| 2001 | 158 | 62 |
| 2002 | 139 | 164 |
| 2003 | 159 | 183 |
| 2004 | 139 | 172 |
| 2005 | 117 | 159 |
| 2006 | 103 | 146 |
| 2007 | 112 | 153 |
| 2008 | 78 | 147 |
| 2009 | 77 | 154 |
| 2010 | 118 | 138 |
| 2011 | 88 | 120 |
| 2012 | 103 | 115 |
| 2013 | 85 | 105 |
| 2014 | 86 | 133 |
| 2015 | 86 | 138 |
| 2016 | 112 | 117 |
| 2017 | 132 | 85 |
| 2018 | 89 | 99 |
| 2019 | 93 | 98 |
| 2020 | 97 | 101 |
| 2021 | 75 | 80 |
| 2022 | 62 | 95 |
| 2023 | 65 | 88 |
| 2024 | 76 | 76 |
| 2025 | 60 | 55 |
| 2026 | 32 | 131 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Removable lid for flip chip-ball grid array (FC-BGA) packages7 Jul 2026US 12,677,380 B2Mellanox Technologies, Ltd.
- Electronic package and method for forming the same16 Jun 2026US 12,660,097 B2
- Electronic package and method for forming the same1 Oct 2026US 2026/0304642 A1JCET STATS ChipPAC Korea Limited
- Circuit board, semiconductor device, and method for manufacturing semiconductor device27 Aug 2026US 2026/0255471 A1Kioxia Corporation
- Wiring board and method of manufacturing wiring board27 Aug 2026US 2026/0255491 A1Shinko Electric Industries Co., Ltd.
- Electronic module13 Aug 2026US 2026/0239542 A1Delta Electronics, Inc.
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Most cited
By later US patents
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Substrate for packaging a semiconductor device370US 5,214,308 ASumitomo Electric Industries, Ltd. · 1993
- Circuit structure including a passive element formed within a grid array substrate and method for making the same370US 6,362,525 B1Cypress Semiconductor Corporation · 2002
- Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making339US 4,604,644 AInternational Business Machines Corporation · 1986
- Methods of assembling microelectronic assembly with socket for engaging bump leads327US 5,802,699 ATessera, Inc. · 1998