Electronic package and method for forming the same

An electronic component, comprising:

• a substrate;
• a first set of conductive pads on the substrate and at which a set of terminals of a first electronic component are to be mounted, respectively;
• a second set of conductive pads on the substrate and at which a set of terminals of a second electronic component are to be mounted, respectively;
• and
• solder paste formed on each of the first set of conductive pads and each of the second set of conductive pads, wherein the solder paste exposes a portion of a surface of a conductive pad of the first set of conductive pads that is facing away from the others of the first set of conductive pads but does not substantially expose another portion of the surface of the conductive pad that is facing towards the others of the first set of conductive pads, wherein the solder paste on a conductive pad of the first set of conductive pads defines a paste periphery having an outer edge facing away from the others of the first set of conductive pads and defining a gap exposing the portion of the surface of the conductive pad of the first set of conductive pads, and wherein the gap faces towards a conductive pad of the second set of conductive pads such that the solder paste underneath the first and second electronic components does not form a solder bridge after its reflow process.