Removable lid for flip chip-ball grid array (FC-BGA) packages

A method for manufacturing an electronic apparatus, comprising:

• providing a substrate;
• assembling an integrated circuit (IC) package by:
• connecting electrical components to the substrate;
• attaching at least one pedestal to the substrate;
• using a plurality of fasteners to reversibly secure a lid to the at least one pedestal, wherein the at least one pedestal, the lid, and the plurality of fasteners form a removable lid assembly;
• and
• installing the IC package on a printed circuit board (PCB) using a reflow process,
• wherein the removable lid assembly enhances a stiffness of the substrate, thereby reducing warpage of the substrate during the reflow process that is applied to the substrate.

A system configured to enable ball grid array (BGA) reflow on an IC package, the system comprising:

• a substrate;
• electrical components supported by the substrate;
• and
• a removable lid assembly attached to the substrate, wherein the removable lid assembly comprises:
• at least one pedestal configured to be attached to the substrate;
• a lid configured to be reversibly secured to the at least one pedestal;
• and
• a plurality of fasteners configured to reversibly secure the lid to the at least one pedestal,
• wherein the substrate, the electrical components, and the removable lid assembly form an IC package,
• wherein the lid is spaced from the electrical components, and
• wherein the removable lid assembly enhances a stiffness of the IC package, thereby reducing warpage of the substrate during a reflow process applied to the IC package.