Wiring board and method of manufacturing wiring board

Abstract

A wiring board includes a connecting terminal that is formed on an upper surface of an insulating layer. The connecting terminal includes a seed layer, a post of a metal, a protective metal layer, a solder layer, and an alloy layer. The seed layer is layered on the upper surface of the insulating layer. The post is layered on an upper surface of the seed layer. The protective metal layer is layered on an upper surface of the post. The solder layer is formed on an upper surface of the protective metal layer. The alloy layer is formed in an interface between the protective metal layer and the solder layer. The solder layer covers an upper surface and a side surface of the alloy layer. The side surface of the alloy layer is positioned on a center side of the post with respect to a side surface of the post.

Dependencies are inferred from the claim text.