Electronic package and method for forming the same

Abstract

Provided is a method for forming an electronic package, comprising: providing a substrate comprising a first set of conductive pads at which a set of terminals of a first electronic component are to be mounted, respectively; forming solder paste on each of the first set of conductive pads, wherein the solder paste exposes a portion of a surface of a conductive pad that is facing away from the others of the first set of conductive pads but does not substantially expose another portion of the surface of the conductive pad that is facing towards the others of the first set of conductive pads; placing the first electronic component on the substrate with the set of terminals of the first electronic component aligned with the first set of conductive pads; reflowing the solder paste on the first set of conductive pads to secure the first electronic component onto the substrate.

Dependencies are inferred from the claim text.