Manufacturing method for component mounting substrate

A manufacturing method for a component mounting board including a circuit board having a first surface and a second surface on an opposite side to the first surface, and a plurality of components mounted on both surfaces of the circuit board, the method comprising:

• a solder precoat portion formation step of forming solder precoat portions on a plurality of first lands on the first surface of the circuit board;
• a first arrangement step of arranging a plurality of first components on the solder precoat portions;
• a first reflow step of soldering the plurality of first components by heating the circuit board on which the plurality of first components are arranged;
• a solder paste application step of applying solder paste to a plurality of second lands on the second surface of the circuit board;
• a second arrangement step of arranging a plurality of second components on the solder paste;
• and
• a second reflow step of soldering the plurality of second components by heating the circuit board on which the plurality of second components are arranged,
• wherein lands having an area of 0.04 mm2 or less among the plurality of first lands are greater in number than lands having an area of 0.04 mm2 among the plurality of second lands.

A manufacturing method for a component mounting board including a circuit board having a first surface and a second surface on an opposite side to the first surface, and a plurality of components mounted on both surfaces of the circuit board, the method comprising:

• a solder precoat portion formation step of forming solder precoat portions on a plurality of first lands on the first surface of the circuit board;
• a first arrangement step of arranging a plurality of first components on the solder precoat portions;
• a first reflow step of soldering the plurality of first components by heating the circuit board on which the plurality of first components are arranged;
• a solder paste application step of applying solder paste to a plurality of second lands on the second surface of the circuit board;
• a second arrangement step of arranging a plurality of second components on the solder paste;
• and
• a second reflow step of soldering the plurality of second components by heating the circuit board on which the plurality of second components are arranged,
• wherein lands adjacent with a distance of 0.1 mm or less therebetween among the plurality of first lands are greater in number than lands adjacent with a distance of 0.1 mm or less therebetween among the plurality of second lands.

A manufacturing method for a component mounting board including a circuit board having a first surface and a second surface on an opposite side to the first surface, and a plurality of components mounted on both surfaces of the circuit board, the method comprising:

• a solder precoat portion formation step of forming solder precoat portions on a plurality of first lands on the first surface of the circuit board;
• a first arrangement step of arranging a plurality of first components on the solder precoat portions;
• a first reflow step of soldering the plurality of first components by heating the circuit board on which the plurality of first components are arranged;
• a solder paste application step of applying solder paste to a plurality of second lands on the second surface of the circuit board;
• a second arrangement step of arranging a plurality of second components on the solder paste;
• and
• a second reflow step of soldering the plurality of second components by heating the circuit board on which the plurality of second components are arranged,
• wherein the plurality of first components include micro components having a size not larger than an 0402 size prescribed by JIS, and
• the micro components adjacent with a distance of 0.1 mm or less therebetween among the plurality of first components are greater in number than the micro components adjacent with a distance of 0.1 mm or less therebetween among the plurality of second components.