H05K 3/3415
On both sides of the substrate or combined with lead-in-hole components
Official title: {on both sides of the substrate or combined with lead-in-hole components}
H05K3/3415 (On both sides of the substrate or combined with lead-in-hole components) appears on 241 US grants and 185 published applications in this corpus.
Search patents in H05K- Granted patents
- 241
- Published applications
- 185
- Assignees
- 156
- Inventors
- 581
- Latest grant
- 16 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 6 | 0 |
| 1991 | 5 | 0 |
| 1992 | 6 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 8 | 0 |
| 1997 | 7 | 0 |
| 1998 | 7 | 0 |
| 1999 | 6 | 0 |
| 2000 | 9 | 0 |
| 2001 | 10 | 5 |
| 2002 | 9 | 6 |
| 2003 | 8 | 14 |
| 2004 | 13 | 11 |
| 2005 | 10 | 8 |
| 2006 | 5 | 8 |
| 2007 | 9 | 9 |
| 2008 | 3 | 7 |
| 2009 | 6 | 6 |
| 2010 | 2 | 5 |
| 2011 | 5 | 6 |
| 2012 | 5 | 4 |
| 2013 | 5 | 3 |
| 2014 | 4 | 5 |
| 2015 | 6 | 10 |
| 2016 | 5 | 8 |
| 2017 | 7 | 6 |
| 2018 | 4 | 9 |
| 2019 | 4 | 6 |
| 2020 | 8 | 7 |
| 2021 | 6 | 15 |
| 2022 | 7 | 5 |
| 2023 | 4 | 8 |
| 2024 | 7 | 8 |
| 2025 | 10 | 4 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Package substrate16 Dec 2025US 12,501,548 B2LG Innotek Co., Ltd.
- Circuit board assembly2 Dec 2025US 12,490,381 B2Tyco Electronics (Shanghai) Co., Ltd.
- Electronic module assembly structure2 Sep 2025US 12,408,278 B2Delta Electronics, Inc.
- Method for forming power module package, power module package and electronic device12 Aug 2025US 12,389,553 B2Delta Electronics, Inc.
- Inverter having heat conducting component12 Aug 2025US 12,389,574 B2Sungrow (Shanghai) Co., Ltd.
- Printed circuit board assembly26 Feb 2026US 2026/0059647 A1Rolls-Royce Deutschland Ltd & Co KG
- Power stage package and manufacturing method thereof, voltage regulating module and electronic device5 Feb 2026US 2026/0040429 A1Ark HDPS Semiconductor Pte. LIMITED.
- Circuit arrangement23 Oct 2025US 2025/0331105 A1Continental Autonomous Mobility Germany GmbH
- Smart yarn and method for manufacturing a yarn containing an electronic device26 Jun 2025US 2025/0207302 A1
- Dc/dc partial power converter based on pcb embedding technology6 Mar 2025US 2025/0079988 A1Huawei Digital Power Technologies Co., Ltd.
Most cited
By later US patents
- Method of mounting interrelated components150US 4,371,912 AMotorola, Inc. · 1983
- Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array120US 5,490,040 AInternational Business Machines Corporation · 1996
- Card type semiconductor device96US 5,821,614 ASeiko Epson Corporation · 1998
- Double-sided flexible electronic circuit module92US 4,567,543 AMotorola, Inc. · 1986
- Multi-level assemblies for interconnecting integrated circuits88US 5,479,319 AInterconnect Systems, Inc. · 1995