Electronic module assembly structure

An electronic module assembly structure, comprising:

• a system board comprising a first upper surface and a first lower surface opposite to each other;
• an electronic module spatially corresponding to the first upper surface of the system board, and comprising a plurality of leading pins and at least one carrier, wherein each of the plurality of leading pins has a soldering surface and is connected to the first upper surface of the system board through a first reflow soldering process, wherein the at least one carrier has a carrying surface, wherein when the plurality of leading pins are connected to the first upper surface of the system board, a height difference is formed between the carrying surface of the at least one carrier and the soldering surface of the plurality of pins;
• and
• an adhesive material disposed on the carrying surface of the at least one carrier or the first upper surface of the system board corresponding to the carrying surface, wherein the adhesive material connects the at least one carrier of the electronic module with the first upper surface of the system board, so that the electronic module is fixed to the first upper surface of the system board through the adhesive material.