Inverter having heat conducting component

An inverter, comprising a substrate, a discrete device, a PCB board, and electronic components,

• wherein the electronic components are configured to be inserted and soldered on the PCB board, and the discrete device is configured to be soldered on the PCB board from one side of the discrete device,
• wherein the other side of the discrete device is arranged on a side of the substrate to dissipate heat generated by the discrete device through the substrate,
• wherein the inverter further comprises:
• a heat conducting component, the heat conducting component is arranged on the substrate, a part of the heat conducting component is located in an area of the substrate where the discrete device is provided, and another part of the heat conducting component is located in an area of the substrate where no discrete device is provided, a heat conducting component mounting groove is defined on the substrate, the heat conducting component is arranged in the heat conducting component mounting groove;
• a heat sink arranged on the other side of the substrate and integrated with the substrate, wherein the heat sink is configured to dissipate heat from the substrate;
• and
• a mounting assembly, wherein the mounting assembly is configured to fix the discrete device onto the substrate on which the heat conducting component is mounted,
• wherein the mounting assembly comprises
• a heat conducting gasket, wherein the discrete device is placed on the heat conducting gasket and the heat conducting gasket is in contact with the heat conducting component, wherein a gasket mounting groove is defined on the substrate, and the heat conducting gasket is placed in the gasket mounting groove and above the heat conducting component and is directly in contact with the discrete device;
• a pressing sheet which is placed on the discrete device;
• and
• a fixing member which is configured to fix the pressing sheet to the substrate,
• wherein the fixing member passes through the pressing sheet and the substrate in turn to fix the pressing sheet to the substrate.