US 12,501,548 B2 · Package substrate

Abstract

A package substrate according to an embodiment includes an insulating layer; a first outer circuit pattern disposed on an upper surface of the insulating layer; a second outer circuit pattern disposed under a lower surface of the insulating layer; a first connection portion disposed on an upper surface of a first-first circuit pattern of the first outer circuit pattern; a first contact portion disposed on the first connection portion; a first device disposed on the first connection portion through the first contact portion; a second contact portion disposed under a lower surface of a second-first circuit pattern of the second outer circuit pattern; a second device attached to the second-first circuit pattern through the second contact portion; and a second connection portion disposed under a lower surface of a second-second circuit pattern of the second outer circuit pattern; wherein the first connection portion is disposed with a first width and a first interval, and wherein the second connection portion is disposed with a second width greater than the first width and a second interval greater than the first interval.

Claims18

Dependent claims

A circuit board comprising:

an insulating structure including a plurality of insulating layers stacked along a vertical direction;
a connection part disposed under the insulating structure;
a first semiconductor device disposed under the connection part;
a first bump layer disposed under the insulating structure and spaced apart from the connection part and the first semiconductor device along a horizontal direction;
a second bump layer disposed under the insulating structure and spaced apart from the connection part, the first semiconductor device, and the first bump laver,
wherein the first bump layer overlaps the connection part and the first semiconductor device along the horizontal direction, and
wherein a width of the first bump layer in the horizontal direction and a width of the second bump layer in the horizontal direction are different from each other.

4 more elements

Dependencies are inferred from the claim text.

Package substrate

Life of this patent

Package substrate

Life of this patent

Abstract

Claims18