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US 2026/0292998 A1Published application
Connection carrier, method for producing a solder joint and device
Assigneeams-OSRAM International GmbH
InventorsSebastian Wittmann, Markus Kirsch
Life of this patent
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Abstract
In an embodiment a connection carrier includes a main body with a metallization and a solder resist layer arranged at least in places on the metallization, wherein the solder resist layer has a thickness of at most 5 micrometers, and wherein the main body is transparent to visible light, IR radiation and/or UV radiation.
Claims18
-17. (canceled)
A connection carrier comprising:
- a main body with a metallization;
- and
- a solder resist layer arranged at least in places on the metallization,
- wherein the solder resist layer comprises a thickness of at most 5 micrometers, and
- wherein the main body is transparent to visible light, IR radiation and/or UV radiation.
2 more elements
A method for producing a solder joint, the method comprising:
- providing a connection carrier comprising a main body with a metallization, wherein a solder resist layer is applied at least in places on the metallization, wherein the solder resist layer comprises a thickness of at most 5 micrometers, and wherein the main body is transparent to visible light, IR radiation and/or UV radiation;
- applying a solder paste next to or on the solder resist layer;
- applying an electronic component;
- at least partially melting the solder paste;
- and
- forming the solder joint.
3 more elements
Dependencies are inferred from the claim text.