H05K 3/3421
Leaded components
Official title: {Leaded components}
H05K3/3421 (Leaded components) appears on 1,984 US grants and 1,381 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,984
- Published applications
- 1,381
- Assignees
- 743
- Inventors
- 3,689
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 11 | 0 |
| 1978 | 2 | 0 |
| 1979 | 5 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
| 1984 | 6 | 0 |
| 1985 | 10 | 0 |
| 1986 | 19 | 0 |
| 1987 | 28 | 0 |
| 1988 | 41 | 0 |
| 1989 | 34 | 0 |
| 1990 | 46 | 0 |
| 1991 | 51 | 0 |
| 1992 | 41 | 0 |
| 1993 | 43 | 0 |
| 1994 | 56 | 0 |
| 1995 | 58 | 0 |
| 1996 | 62 | 0 |
| 1997 | 57 | 0 |
| 1998 | 69 | 0 |
| 1999 | 99 | 0 |
| 2000 | 82 | 0 |
| 2001 | 88 | 35 |
| 2002 | 76 | 86 |
| 2003 | 77 | 95 |
| 2004 | 83 | 95 |
| 2005 | 60 | 87 |
| 2006 | 66 | 72 |
| 2007 | 54 | 80 |
| 2008 | 51 | 82 |
| 2009 | 46 | 77 |
| 2010 | 49 | 67 |
| 2011 | 51 | 54 |
| 2012 | 62 | 38 |
| 2013 | 29 | 28 |
| 2014 | 24 | 33 |
| 2015 | 27 | 33 |
| 2016 | 29 | 37 |
| 2017 | 30 | 36 |
| 2018 | 46 | 38 |
| 2019 | 38 | 32 |
| 2020 | 39 | 41 |
| 2021 | 24 | 36 |
| 2022 | 26 | 25 |
| 2023 | 30 | 32 |
| 2024 | 19 | 19 |
| 2025 | 16 | 10 |
| 2026 | 11 | 113 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Single-layer printed circuit board for a lighting device18 Aug 2026US 12,710,144 B2Lutron Technology Company LLC
- Printed circuit board, maintenance method therefor, and display apparatus28 Jul 2026US 12,696,388 B2Boe Technology Group Co., Ltd.
- Sensor module14 Jul 2026US 12,684,693 B2Seiko Epson Corporation
- Solder connection between a coaxial cable and a printed circuit board arrangement and a mobile communication antenna comprising such a solder connection23 Jun 2026US 12,665,323 B2Telefonaktiebolaget LM Ericsson (publ)
- Leadframe mounting with lead insertion for lead wall bonding9 Jun 2026US 12,652,759 B2Semiconductor Components Industries, LLC
- Leadframe mounting with lead insertion for lead wall bonding17 Sep 2026US 2026/0282230 A1Semiconductor Components Industries, LLC
- Semiconductor package warpage and alignment management17 Sep 2026US 2026/0282241 A1Arm Limited
- Memory system with direct chip attach memory die10 Sep 2026US 2026/0271804 A1Micron Technology, Inc.
- Manufacturing method for a mounting board and mounting board20 Aug 2026US 2026/0248020 A1Sony Semiconductor Solutions Corporation
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
Most cited
By later US patents
- Oximeter sensor assembly with integral cable1,236US 4,964,408 AThor Technology Corporation · 1990
- Oximeter sensor assembly with integral cable and encoder1,015US 5,069,213 AThor Technology Corporation · 1991
- Oximeter sensor assembly with integral cable and method of forming the same965US 5,041,187 AThor Technology Corporation · 1991
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995