H05K 3/3426
Characterised by the leads
Official title: {characterised by the leads}
H05K3/3426 (Characterised by the leads) appears on 1,063 US grants and 827 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,063
- Published applications
- 827
- Assignees
- 419
- Inventors
- 1,882
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 4 | 0 |
| 1978 | 1 | 0 |
| 1979 | 3 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 7 | 0 |
| 1986 | 11 | 0 |
| 1987 | 19 | 0 |
| 1988 | 21 | 0 |
| 1989 | 9 | 0 |
| 1990 | 20 | 0 |
| 1991 | 18 | 0 |
| 1992 | 15 | 0 |
| 1993 | 11 | 0 |
| 1994 | 26 | 0 |
| 1995 | 32 | 0 |
| 1996 | 28 | 0 |
| 1997 | 22 | 0 |
| 1998 | 31 | 0 |
| 1999 | 57 | 0 |
| 2000 | 46 | 0 |
| 2001 | 53 | 23 |
| 2002 | 47 | 62 |
| 2003 | 49 | 60 |
| 2004 | 56 | 63 |
| 2005 | 36 | 59 |
| 2006 | 49 | 48 |
| 2007 | 32 | 45 |
| 2008 | 33 | 41 |
| 2009 | 25 | 44 |
| 2010 | 26 | 31 |
| 2011 | 30 | 31 |
| 2012 | 37 | 18 |
| 2013 | 12 | 11 |
| 2014 | 11 | 11 |
| 2015 | 13 | 19 |
| 2016 | 19 | 20 |
| 2017 | 19 | 15 |
| 2018 | 20 | 18 |
| 2019 | 22 | 22 |
| 2020 | 22 | 21 |
| 2021 | 12 | 18 |
| 2022 | 16 | 15 |
| 2023 | 15 | 19 |
| 2024 | 8 | 8 |
| 2025 | 10 | 3 |
| 2026 | 5 | 102 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board, maintenance method therefor, and display apparatus28 Jul 2026US 12,696,388 B2Boe Technology Group Co., Ltd.
- Leadframe mounting with lead insertion for lead wall bonding9 Jun 2026US 12,652,759 B2Semiconductor Components Industries, LLC
- Board-to-board connector19 May 2026US 12,633,690 B2Japan Aviation Electronics Industry, Limited
- Printed circuit board, battery module, battery pack, and electrical device5 May 2026US 12,620,635 B2Contemporary Amperex Technology (Hong Kong) Limited
- LED electrical contact for 3D LEDs14 Apr 2026US 12,604,772 B2Lumileds Singapore Pte. Ltd.
- Leadframe mounting with lead insertion for lead wall bonding17 Sep 2026US 2026/0282230 A1Semiconductor Components Industries, LLC
- Semiconductor package warpage and alignment management17 Sep 2026US 2026/0282241 A1Arm Limited
- Memory system with direct chip attach memory die10 Sep 2026US 2026/0271804 A1Micron Technology, Inc.
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
- High Current Column Grid Array Pillars13 Aug 2026US 2026/0240010 A1
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Encapsulated semiconductor device package having holes for electrically conductive material423US 5,608,265 AHitachi, Ltd. · 1997
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999