H05K 3/3465
Application of solder
H05K3/3465 (Application of solder) appears on 3,260 US grants and 2,524 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,260
- Published applications
- 2,524
- Assignees
- 1,038
- Inventors
- 6,010
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 12 | 0 |
| 1978 | 11 | 0 |
| 1979 | 7 | 0 |
| 1980 | 8 | 0 |
| 1981 | 13 | 0 |
| 1982 | 17 | 0 |
| 1983 | 33 | 0 |
| 1984 | 22 | 0 |
| 1985 | 21 | 0 |
| 1986 | 35 | 0 |
| 1987 | 40 | 0 |
| 1988 | 29 | 0 |
| 1989 | 51 | 0 |
| 1990 | 38 | 0 |
| 1991 | 56 | 0 |
| 1992 | 56 | 0 |
| 1993 | 58 | 0 |
| 1994 | 58 | 0 |
| 1995 | 53 | 0 |
| 1996 | 68 | 0 |
| 1997 | 80 | 0 |
| 1998 | 109 | 0 |
| 1999 | 121 | 0 |
| 2000 | 136 | 0 |
| 2001 | 150 | 69 |
| 2002 | 163 | 124 |
| 2003 | 131 | 119 |
| 2004 | 111 | 128 |
| 2005 | 87 | 149 |
| 2006 | 76 | 161 |
| 2007 | 75 | 181 |
| 2008 | 78 | 159 |
| 2009 | 105 | 199 |
| 2010 | 127 | 131 |
| 2011 | 98 | 104 |
| 2012 | 119 | 78 |
| 2013 | 61 | 77 |
| 2014 | 69 | 92 |
| 2015 | 75 | 101 |
| 2016 | 77 | 73 |
| 2017 | 70 | 61 |
| 2018 | 59 | 59 |
| 2019 | 43 | 60 |
| 2020 | 61 | 81 |
| 2021 | 56 | 63 |
| 2022 | 52 | 69 |
| 2023 | 58 | 65 |
| 2024 | 35 | 49 |
| 2025 | 52 | 38 |
| 2026 | 31 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Sealed squeegee for supplying solder paste with uniform density6 Oct 2026US 12,752,358 B2Ese Co., Ltd.
- Conveyance device and conveyance method18 Aug 2026US 12,709,092 B2Fuji Corporation
- Self correcting oven technology11 Aug 2026US 12,703,036 B2Jabil Inc.
- Flexible circuit board11 Aug 2026US 12,707,564 B2Chipbond Technology Corporation
- Surface modification of solder paste stencils4 Aug 2026US 12,697,808 B2Newtech LLC
- Method of forming an electronic assembly having a conformal coating, electronic assembly and film precursor to conformal coating8 Oct 2026US 2026/0313811 A1
- Electronic package and method for forming the same1 Oct 2026US 2026/0304642 A1JCET STATS ChipPAC Korea Limited
- Leadframe mounting with lead insertion for lead wall bonding17 Sep 2026US 2026/0282230 A1Semiconductor Components Industries, LLC
- Optimized system and method for solder ball flattening in printed circuit board manufacturing process10 Sep 2026US 2026/0267321 A1Nan Ya Plastics Corporation
- Printing operation with improved stencil separation27 Aug 2026US 2026/0249633 A1Asmpt Smt Singapore Pte. Ltd.
Most cited
By later US patents
- Ball grid assembly type semiconductor device having a heat diffusion function and an electric and magnetic shielding function310US 5,640,047 AMitsui High-Tec, Inc. · 1997
- Process for electroless plating tin, lead or tin-lead alloy267US 5,248,527 AC. Uyemura & Co., Ltd. · 1993
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Wire interconnect structures for connecting an integrated circuit to a substrate216US 5,334,804 AFujitsu Limited · 1994
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997