Back to results
US 12,697,808 B2Granted
Surface modification of solder paste stencils
AssigneeNewtech LLC
InventorsSteven Martin Johnson, Fraser Murray Shaw
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to surface modification of solder paste stencils to provide improved adhesion of a functional coating. The disclosed surface modifications include laser structuring, plasma treatments, and primers. Methods of using the solder paste stencils are further disclosed.
Claims13
A method of modifying one or more surfaces of a stencil, the method comprising:
- forming apertures in the one or more surfaces with a first laser;
- ablating the one or more surfaces and/or one or more aperture walls of the formed apertures with laser radiation from a second laser, wherein the laser radiation comprises a wavelength of about 1064 nm;
- treating the one or more surfaces with a plasma treatment process to form a functionalized primer layer;
- and
- applying a hydrophobic and oleophobic coating;
- wherein the step of ablating forms structures and removes contaminants present in the one or more surfaces and/or the one or more aperture walls of the formed apertures, wherein the structures in the one or more surfaces and/or the one or more aperture walls of the formed apertures comprise a three-dimensional pattern, wherein the three-dimensional pattern comprises an orthogonal grid of divots, and wherein each divot is spaced apart by about 50 μm to 150 μm in each coordinate direction of each divot.
3 more elements
Dependencies are inferred from the claim text.