H05K 3/3473
Plating of solder
H05K3/3473 (Plating of solder) appears on 342 US grants and 176 published applications in this corpus.
Search patents in H05K- Granted patents
- 342
- Published applications
- 176
- Assignees
- 166
- Inventors
- 694
- Latest grant
- 20 Aug 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 5 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 5 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 2 | 0 |
| 1986 | 10 | 0 |
| 1987 | 9 | 0 |
| 1988 | 4 | 0 |
| 1989 | 10 | 0 |
| 1990 | 4 | 0 |
| 1991 | 11 | 0 |
| 1992 | 15 | 0 |
| 1993 | 12 | 0 |
| 1994 | 11 | 0 |
| 1995 | 8 | 0 |
| 1996 | 12 | 0 |
| 1997 | 10 | 0 |
| 1998 | 15 | 0 |
| 1999 | 12 | 0 |
| 2000 | 10 | 0 |
| 2001 | 11 | 2 |
| 2002 | 13 | 10 |
| 2003 | 14 | 13 |
| 2004 | 14 | 14 |
| 2005 | 9 | 14 |
| 2006 | 9 | 18 |
| 2007 | 8 | 15 |
| 2008 | 7 | 12 |
| 2009 | 4 | 15 |
| 2010 | 6 | 6 |
| 2011 | 11 | 7 |
| 2012 | 10 | 7 |
| 2013 | 7 | 4 |
| 2014 | 4 | 4 |
| 2015 | 4 | 8 |
| 2016 | 4 | 3 |
| 2017 | 4 | 2 |
| 2018 | 2 | 1 |
| 2019 | 0 | 1 |
| 2020 | 2 | 7 |
| 2021 | 7 | 7 |
| 2022 | 8 | 3 |
| 2023 | 1 | 1 |
| 2024 | 2 | 1 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Pre-plating of solder layer on solderable elements for diffusion soldering20 Aug 2024US 12,069,802 B2Infineon Technologies AG
- Composite solder balls metallised on the surface and calibrated for the assembly of electronic boards9 Jul 2024US 12,030,138 B2Lipco Industrie
- Printed wiring board and method for manufacturing the same15 Aug 2023US 11,729,911 B2Ibiden Co., Ltd.
- Apparatus and method relating to electrochemical migration11 Oct 2022US 11,470,727 B2Jaguar Land Rover Limited
- Method of manufacturing circuit board16 Aug 2022US 11,419,222 B2Unimicron Technology Corp.
- Circuit board3 Jul 2025US 2025/0220810 A1LG Innotek Co., Ltd.
- Pre-Plating of Solder Layer on Solderable Elements for Diffusion Soldering7 Nov 2024US 2024/0373548 A1Infineon Technologies AG
- Tin or tin alloy electroplating solution, method for forming bumps, and method for producing circuit board9 Feb 2023US 2023/0038219 A1Mitsubishi Materials Corporation
- Composite solder balls metallised on the surface and calibrated for the assembly of electronic boards27 Oct 2022US 2022/0339742 A1Lifco Industrie
- Printed wiring board and method for manufacturing the same2 Jun 2022US 2022/0174815 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Process for electroless plating tin, lead or tin-lead alloy267US 5,248,527 AC. Uyemura & Co., Ltd. · 1993
- Wire interconnect structures for connecting an integrated circuit to a substrate216US 5,334,804 AFujitsu Limited · 1994
- Low temperature method for forming solder bump interconnections to a plated circuit trace139US 5,269,453 AMotorola, Inc. · 1993
- Wire interconnect structures for connecting an integrated circuit to a substrate112US 5,773,889 AFujitsu Limited · 1998
- Fine pitch bumping with improved device standoff and bump volume101US 6,372,622 B1Motorola, Inc. · 2002