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US 11,470,727 B2Granted
Apparatus and method relating to electrochemical migration
AssigneeJaguar Land Rover Limited
InventorThomas Liedtke
Life of this patent
Estimating the term…
Abstract
Embodiments of the present invention provide a method (1000) of assembling an electrical circuit comprising one or more copper electrical conductors, the method comprising plating (1010) a surface of the one or more conductors with a layer comprising tin; annealing the plating; applying (1020) solder to at least a portion of the one or more electrical conductors, wherein said solder comprises tin and copper; and annealing the electrical circuit.
Claims20
A method of assembling an electrical circuit comprising one or more copper electrical conductors, the method comprising:
- plating a surface of the one or more conductors with a layer comprising tin;
- applying solder to at least a portion of the one or more electrical conductors, wherein said solder comprises tin and copper and is substantially free of silver;
- and
- annealing the electrical circuit having the solder applied to the at least a portion of the one or more electrical conductors at a temperature of up to around 150° C.
1 more element
An electrical circuit, comprising:
- one or more copper electrical conductors having a tin plating;
- and
- solder comprising tin and copper applied to at least a portion of the one or more electrical conductors and annealed at a temperature of up to around 150° C., wherein the solder is substantially free of silver.
Dependencies are inferred from the claim text.