Printed wiring board and method for manufacturing the same

A method for manufacturing a printed wiring board, comprising:

• forming a conductor layer on a base insulating layer such that the conductor layer includes a plurality of conductor pads;
• forming a solder resist layer on the base insulating layer such that the solder resist layer covers the conductor layer and that the solder resist layer has a plurality of openings exposing the plurality of conductor pads, respectively;
• forming directly on a first conductor pad of the plurality of conductor pads a bump comprising a base plating layer and a top plating layer;
• and
• forming directly on a second conductor pad of the plurality of conductor pads an underlayer comprising a metal that is different from a metal of the conductor layer,
• wherein the forming of the bump includes forming the base plating layer in an opening of the plurality of openings and forming the top plating layer on the base plating layer such that a metal of the base plating layer is same as the metal of the conductor layer, and a bump that is same as the bump formed on the first conductor pad is not formed on the underlayer on the second conductor pad.