H05K 3/3468
Application of molten solder
Official title: Application of molten solder, e.g. dip soldering
H05K3/3468 (Application of molten solder) appears on 551 US grants and 289 published applications in this corpus.
Search patents in H05K- Granted patents
- 551
- Published applications
- 289
- Assignees
- 306
- Inventors
- 1,056
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 6 | 0 |
| 1978 | 5 | 0 |
| 1979 | 4 | 0 |
| 1980 | 2 | 0 |
| 1981 | 6 | 0 |
| 1982 | 10 | 0 |
| 1983 | 23 | 0 |
| 1984 | 12 | 0 |
| 1985 | 10 | 0 |
| 1986 | 15 | 0 |
| 1987 | 17 | 0 |
| 1988 | 12 | 0 |
| 1989 | 25 | 0 |
| 1990 | 12 | 0 |
| 1991 | 17 | 0 |
| 1992 | 9 | 0 |
| 1993 | 15 | 0 |
| 1994 | 12 | 0 |
| 1995 | 10 | 0 |
| 1996 | 20 | 0 |
| 1997 | 20 | 0 |
| 1998 | 19 | 0 |
| 1999 | 6 | 0 |
| 2000 | 23 | 0 |
| 2001 | 20 | 4 |
| 2002 | 20 | 16 |
| 2003 | 12 | 14 |
| 2004 | 18 | 13 |
| 2005 | 7 | 9 |
| 2006 | 7 | 20 |
| 2007 | 4 | 19 |
| 2008 | 6 | 13 |
| 2009 | 14 | 11 |
| 2010 | 5 | 14 |
| 2011 | 7 | 13 |
| 2012 | 9 | 9 |
| 2013 | 6 | 7 |
| 2014 | 8 | 12 |
| 2015 | 10 | 16 |
| 2016 | 7 | 10 |
| 2017 | 12 | 9 |
| 2018 | 8 | 11 |
| 2019 | 8 | 7 |
| 2020 | 9 | 16 |
| 2021 | 10 | 9 |
| 2022 | 4 | 13 |
| 2023 | 9 | 4 |
| 2024 | 5 | 4 |
| 2025 | 9 | 9 |
| 2026 | 2 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Soldering system and method of use31 Mar 2026US 12,589,445 B2Illinois Tool Works Inc.
- Dual pump system and method to control wavesolder contact length3 Feb 2026US 12,543,271 B1Illinois Tool Works Inc.
- Electronic device and display device using the same23 Dec 2025US 12,506,107 B2LG Display Co., Ltd.
- Soldering apparatus7 Oct 2025US 12,434,316 B2Senju Metal Industry Co., Ltd.
- Solder preform assembly and methods of preforming solder for electronic board assembly30 Sep 2025US 12,432,863 B1Honeywell Federal Manufacturing & Technologies, LLC
- Preheating mechanism of jet soldering apparatus, and jet soldering apparatus16 Jul 2026US 2026/0199996 A1Koki Tec Corp.
- Printed circuit board and manufacturing method thereof16 Jul 2026US 2026/0206134 A1Samsung Electro-Mechanics Co., Ltd.
- Dual pump system and method to control wavesolder contact length18 Jun 2026US 2026/0173278 A1Illinois Tool Works Inc.
- Solder preform assembly and methods of preforming solder for electronic board assembly2 Apr 2026US 2026/0096030 A1Honeywell Federal Manufacturing & Technologies, LLC
- Universal Surface-Mount Semiconductor Package12 Mar 2026US 2026/0076242 A1Adventive International Ltd.
Most cited
By later US patents
- Apparatus and method for injection molding solder and applications thereof186US 5,244,143 AInternational Business Machines Corporation · 1993
- Method of mounting interrelated components150US 4,371,912 AMotorola, Inc. · 1983
- Applying solder to high density substrates139US 5,316,788 AInternational Business Machines Corporation · 1994
- Apparatus and method for forming mold for metallic material108US 5,718,361 AInternational Business Machines Corporation · 1998
- Solder anchor decal and method90US 5,673,846 AInternational Business Machines Corporation · 1997