Solder anchor decal and method
AssigneeInternational Business Machines Corporation
InventorPeter Alfred Gruber
Life of this patent
Estimating the term…
Abstract
A solder decal is produced by a method wherein a decal strip having a plurality of anchor holes is aligned with a mold having a plurality of cells. Liquid solder is injected into the anchor holes and mold cells, and is then allowed to cool to solidify therein. The mold may be separated from the decal strip to form the solder decal containing solder beads each having a stem mechanically joined to the strip at respective ones of the anchor holes. Various forms of the solder decal are used for transferring the solder beads to a substrate or chip, or effecting temporary connections for conducting burn-in and testing, or accommodating thermal mismatch for example.
Claims32
A method of effecting a solder decal comprising:
- aligning in abutting contact a decal strip having a plurality of anchor holes with a mold having a plurality of cells;
- injecting into said anchor holes and said mold cells liquid solder to fill respective pairs thereof;
- and
- cooling said liquid solder in said holes and cells to solidify said solder therein.
A method of effecting a solder decal comprising:
- aligning in abutting contact a decal strip having a plurality of anchor holes with a mold having a plurality of cells;
- injecting into said anchor holes and said mold cells liquid solder to fill respective pairs thereof;
- and
- cooling said liquid solder in said holes and cells to solidify said solder therein;
- and
- wherein each of said mold cells is conically divergent away from said anchor holes, and each of said anchor holes is conically divergent away from said mold cells so that said solidified solder therein mechanically joins said decal strip to said mold to prevent mechanical disassembly thereof.
A method of effecting a solder decal comprising:
- aligning in abutting contact a decal strip having a plurality of anchor holes with a mold having a plurality of cells;
- injecting into said anchor holes and said mold cells liquid solder to fill respective pairs thereof;
- cooling said liquid solder in said holes and cells to solidify said solder therein;
- separating said mold from said decal strip to form said solder decal containing solder beads each having a stem mechanically joined to said strip at respective ones of said anchor holes;
- aligning said solder decal with a first substrate having a plurality of electrically conductive first pads, with said solder beads abutting respective ones of said pads;
- heating said solder beads to reflow said solder and wet said solder to said pads;
- and
- cooling said solder on said pads to metallurgically bond said solder thereto;
- and wherein
- said anchor holes are electrically conductive, and said decal strip has electrically conductive lines extending to said anchor holes;
- and
- said decal strip is maintained adjacent to said first substrate so that solidification of said solder electrically joins said anchor holes to respective ones of said pads.
Dependencies are inferred from the claim text.