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US 2026/0206134 A1Published application
Printed circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsWoo Cheol Shim, Jeha Ryu, Hyun Kyung Park
Life of this patent
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Abstract
A printed circuit board may include an insulating layer, a pad disposed on the insulating layer, a solder resist layer disposed on the insulating layer and having an opening exposing at least a portion of the pad, and a solder bump at least partially disposed in the opening of the solder resist layer. A cross section of the solder bump cut in a direction parallel to the height direction perpendicular to a surface of the solder resist layer has a rectangular shape.
Claims20
A printed circuit board comprising;
- an insulating layer,
- a pad disposed on the insulating layer,
- a solder bump, and
- a solder resist layer disposed on the insulating layer and having an opening exposing at least a portion of the pad to the solder bump,
- wherein the solder bump is at least partially disposed in the opening of the solder resist layer, and
- wherein a cross section of the solder bump has a rectangular shape in a cross-sectional view that is cut in a direction parallel to a height direction that is perpendicular to a surface of the solder resist layer.
3 more elements
A manufacturing method of a printed circuit board, comprising:
- forming a pad disposed on an insulating layer,
- forming a solder resist layer having an opening exposing at least a portion of the pad on the insulating layer,
- forming a solder bump in the opening of the solder resist layer, and
- removing a portion of the solder resist layer by plasma treatment.
1 more element
Dependencies are inferred from the claim text.