H05K 3/3478
Application of solder preforms
Official title: Application of solder preforms; Transferring prefabricated solder patterns
H05K3/3478 (Application of solder preforms) appears on 736 US grants and 565 published applications in this corpus.
Search patents in H05K- Granted patents
- 736
- Published applications
- 565
- Assignees
- 305
- Inventors
- 1,468
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 5 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 2 | 0 |
| 1989 | 9 | 0 |
| 1990 | 9 | 0 |
| 1991 | 2 | 0 |
| 1992 | 10 | 0 |
| 1993 | 13 | 0 |
| 1994 | 8 | 0 |
| 1995 | 7 | 0 |
| 1996 | 9 | 0 |
| 1997 | 25 | 0 |
| 1998 | 28 | 0 |
| 1999 | 43 | 0 |
| 2000 | 41 | 0 |
| 2001 | 51 | 15 |
| 2002 | 34 | 32 |
| 2003 | 40 | 36 |
| 2004 | 22 | 31 |
| 2005 | 32 | 42 |
| 2006 | 22 | 37 |
| 2007 | 18 | 34 |
| 2008 | 17 | 43 |
| 2009 | 26 | 53 |
| 2010 | 41 | 32 |
| 2011 | 29 | 23 |
| 2012 | 23 | 25 |
| 2013 | 8 | 9 |
| 2014 | 13 | 22 |
| 2015 | 14 | 17 |
| 2016 | 13 | 17 |
| 2017 | 12 | 7 |
| 2018 | 12 | 7 |
| 2019 | 9 | 12 |
| 2020 | 13 | 11 |
| 2021 | 8 | 11 |
| 2022 | 7 | 19 |
| 2023 | 15 | 13 |
| 2024 | 8 | 7 |
| 2025 | 11 | 5 |
| 2026 | 4 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Warpage-resilient attachment of die to substrate in mass reflow soldering19 May 2026US 12,635,081 B1Marvell Asia Pte Ltd
- Printed circuit board with a contact point7 Apr 2026US 12,597,750 B2KNORR-BREMSE Systeme fuer Nutzfahrzeuge GmbH
- Sheet-shaped solder3 Feb 2026US 12,539,567 B2Fuji Electric Co., Ltd.
- Indium-niobium superconducting solder columns for cryogenic and quantum computer applications and methods for making same13 Jan 2026US 12,526,920 B1The Topline Corporation
- Ball attach tool9 Dec 2025US 12,495,504 B2Samsung Electronics Co., Ltd.
- Method of forming an electronic assembly having a conformal coating, electronic assembly and film precursor to conformal coating8 Oct 2026US 2026/0313811 A1
- Power module and assembly method therefor16 Jul 2026US 2026/0206145 A1MetaPWR Electronics Co., Ltd.
- Solder preform assembly and methods of preforming solder for electronic board assembly2 Apr 2026US 2026/0096030 A1Honeywell Federal Manufacturing & Technologies, LLC
- Method for normalizing solder interconnects in a circuit package module after removal from a test board5 Feb 2026US 2026/0040459 A1Skyworks Solutions, Inc.
- Semiconductor package with a cavity substrate1 Jan 2026US 2026/0006726 A1UTAC Headquarters Pte. Ltd.
Most cited
By later US patents
- Ball grid assembly type semiconductor device having a heat diffusion function and an electric and magnetic shielding function310US 5,640,047 AMitsui High-Tec, Inc. · 1997
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997
- Solder bump transfer device for flip chip integrated circuit devices189US 5,607,099 ADelco Electronics Corporation · 1997
- Compliant interconnection and method therefor183US 4,642,889 AAMP Incorporated · 1987
- Method of forming solder terminals for a pinless ceramic module160US 4,830,264 AInternational Business Machines Corporation · 1989