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US 12,635,081 B1Granted
Warpage-resilient attachment of die to substrate in mass reflow soldering
AssigneeMarvell Asia Pte Ltd
InventorsHsiu-Che Wang, Dwayne R Shirley, Roberto Coccioli, Pushkraj Tumne
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Abstract
A method for fabricating electronic devices includes applying an array of non-uniformly sized spots of solder material on a substrate. An average size of the spots is larger in a center portion of the array than in a peripheral portion of the array. A die is soldered to the substrate using the array.
Claims19
A method for fabricating electronic devices, the method comprising:
- applying an array of non-uniformly sized spots of solder material on a substrate, wherein an average size of the spots is larger in a center portion of the array than in a peripheral portion of the array;
- and
- soldering a die to the substrate using the array.
A method for fabricating electronic devices, the method comprising:
- applying an array of spots of solder material on a substrate;
- placing a die over the array of spots;
- placing a stiffener over the die;
- and
- soldering the die to the substrate using the array of spots, by a reflow soldering process, while the stiffener is in contact with the die.
2 more elements
An electronic device, comprising:
- a substrate having an array of non-uniformly sized spots of solder material applied thereon, wherein an average size of the spots is larger in a center portion of the array than in a peripheral portion of the array;
- and
- a die, which is soldered to the substrate using the array.
Dependencies are inferred from the claim text.