Method for normalizing solder interconnects in a circuit package module after removal from a test board

A method of modifying a circuit package module, the method comprising:

• placing a circuit package module such that a first side of the circuit package module is exposed, the first side having a plurality of solder interconnects;
• placing a stencil with respect to the first side of the circuit package module, the stencil having a plurality of apertures;
• applying a solder material over the stencil so that the solder material passes through the plurality of apertures and is added onto the plurality of solder interconnects;
• separating the stencil from the circuit package module;
• and
• subsequent to separating the stencil from the circuit package module, reflowing the plurality of solder interconnects with the added solder material.

A method of modifying a circuit package module, the method comprising:

• placing a circuit package module in a recess of a fixture such that a first side of the circuit package module is exposed, the first side having a plurality of solder interconnects;
• placing a stencil with respect to the first side of the circuit package module;
• applying a solder material over the stencil so that the solder material passes through a plurality of apertures of the stencil and is added onto the plurality of solder interconnects;
• separating the stencil from the circuit package module;
• removing the circuit package module from the recess by inserting a tool in one or more slots adjacent to the recess;
• and
• subsequent to removing the circuit package module from the recess, reflowing the plurality of solder interconnects with the added solder material.