Power module and assembly method therefor

Abstract

The present application discloses a stacked power module. A bonding material and solder are provided between stacked layers, and the moment when the bonding material is fully cured is later than the moment when the solder begins to melt, thereby achieving the reliability of the assembly of the stacked layers, and improving the production yield of the stacked power module. On the other hand, the present application further provides an assembly mode of the stacked power module and a system board. For different pin layouts of a lower surface of the stacked power module, several different assembly modes of the stacked power module and the system board are proposed, and the reliability of the assembly process of the stacked power module and the system board is also improved.

Dependencies are inferred from the claim text.