H05K 3/3485
Application of solder paste, slurry or powder
Official title: Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12)
H05K3/3485 (Application of solder paste, slurry or powder) appears on 1,290 US grants and 1,204 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,290
- Published applications
- 1,204
- Assignees
- 508
- Inventors
- 2,672
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 6 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 7 | 0 |
| 1987 | 7 | 0 |
| 1988 | 9 | 0 |
| 1989 | 7 | 0 |
| 1990 | 9 | 0 |
| 1991 | 17 | 0 |
| 1992 | 18 | 0 |
| 1993 | 12 | 0 |
| 1994 | 18 | 0 |
| 1995 | 23 | 0 |
| 1996 | 24 | 0 |
| 1997 | 22 | 0 |
| 1998 | 34 | 0 |
| 1999 | 46 | 0 |
| 2000 | 46 | 0 |
| 2001 | 55 | 23 |
| 2002 | 61 | 52 |
| 2003 | 54 | 46 |
| 2004 | 37 | 57 |
| 2005 | 33 | 68 |
| 2006 | 35 | 67 |
| 2007 | 36 | 83 |
| 2008 | 35 | 76 |
| 2009 | 44 | 86 |
| 2010 | 59 | 61 |
| 2011 | 35 | 55 |
| 2012 | 58 | 32 |
| 2013 | 31 | 56 |
| 2014 | 38 | 59 |
| 2015 | 48 | 49 |
| 2016 | 49 | 37 |
| 2017 | 41 | 35 |
| 2018 | 31 | 24 |
| 2019 | 20 | 34 |
| 2020 | 33 | 46 |
| 2021 | 28 | 26 |
| 2022 | 23 | 29 |
| 2023 | 32 | 32 |
| 2024 | 13 | 31 |
| 2025 | 23 | 17 |
| 2026 | 19 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sealed squeegee for supplying solder paste with uniform density6 Oct 2026US 12,752,358 B2Ese Co., Ltd.
- Conveyance device and conveyance method18 Aug 2026US 12,709,092 B2Fuji Corporation
- Self correcting oven technology11 Aug 2026US 12,703,036 B2Jabil Inc.
- Surface modification of solder paste stencils4 Aug 2026US 12,697,808 B2Newtech LLC
- Reworking solder component without part removal28 Jul 2026US 12,696,399 B2International Business Machines Corporation
- Method of forming an electronic assembly having a conformal coating, electronic assembly and film precursor to conformal coating8 Oct 2026US 2026/0313811 A1
- Electronic package and method for forming the same1 Oct 2026US 2026/0304642 A1JCET STATS ChipPAC Korea Limited
- Leadframe mounting with lead insertion for lead wall bonding17 Sep 2026US 2026/0282230 A1Semiconductor Components Industries, LLC
- Printing operation with improved stencil separation27 Aug 2026US 2026/0249633 A1Asmpt Smt Singapore Pte. Ltd.
- Electrically connecting a flexible circuit to a support structure27 Aug 2026US 2026/0255501 A1Teradyne, Inc.
Most cited
By later US patents
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997
- Method and apparatus for dispensing material in a printer206US 6,453,810 B1Speedline Technologies, Inc. · 2002
- Surface mount solder assembly of leadless integrated circuit packages to substrates197US 5,346,118 AAT&T Bell Laboratories · 1994
- Method for interconnecting a flip chip to a printed circuit substrate194US 5,615,477 ASheldahl, Inc. · 1997