H05K 3/3447
Lead-in-hole components
H05K3/3447 (Lead-in-hole components) appears on 1,466 US grants and 1,027 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,466
- Published applications
- 1,027
- Assignees
- 722
- Inventors
- 3,072
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 9 | 0 |
| 1978 | 19 | 0 |
| 1979 | 11 | 0 |
| 1980 | 13 | 0 |
| 1981 | 12 | 0 |
| 1982 | 15 | 0 |
| 1983 | 18 | 0 |
| 1984 | 13 | 0 |
| 1985 | 24 | 0 |
| 1986 | 24 | 0 |
| 1987 | 27 | 0 |
| 1988 | 24 | 0 |
| 1989 | 27 | 0 |
| 1990 | 31 | 0 |
| 1991 | 27 | 0 |
| 1992 | 25 | 0 |
| 1993 | 31 | 0 |
| 1994 | 30 | 0 |
| 1995 | 28 | 0 |
| 1996 | 30 | 0 |
| 1997 | 26 | 0 |
| 1998 | 34 | 0 |
| 1999 | 32 | 0 |
| 2000 | 36 | 0 |
| 2001 | 48 | 26 |
| 2002 | 49 | 52 |
| 2003 | 42 | 63 |
| 2004 | 67 | 69 |
| 2005 | 49 | 63 |
| 2006 | 36 | 57 |
| 2007 | 39 | 66 |
| 2008 | 39 | 51 |
| 2009 | 46 | 60 |
| 2010 | 36 | 53 |
| 2011 | 30 | 42 |
| 2012 | 42 | 27 |
| 2013 | 28 | 31 |
| 2014 | 22 | 19 |
| 2015 | 20 | 27 |
| 2016 | 25 | 31 |
| 2017 | 31 | 27 |
| 2018 | 25 | 29 |
| 2019 | 27 | 33 |
| 2020 | 35 | 39 |
| 2021 | 24 | 59 |
| 2022 | 24 | 25 |
| 2023 | 47 | 27 |
| 2024 | 28 | 21 |
| 2025 | 17 | 16 |
| 2026 | 11 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Solder reflow apparatus and method of manufacturing an electronic device4 Aug 2026US 12,701,664 B2Samsung Electronics Co., Ltd.
- Reworking solder component without part removal28 Jul 2026US 12,696,399 B2International Business Machines Corporation
- Methods of manufacture of multi-diameter female contacts with a circuit board30 Jun 2026US 12,672,242 B2Eagle Technology, LLC
- Receptacle assembly and circuit board9 Jun 2026US 12,652,751 B2Yamaichi Electronics Co., Ltd.
- Electronic device with multi-diameter female contacts and related methods1 Oct 2026US 2026/0304640 A1Eagle Technology, LLC
- Electronic assembly including a connecting fork13 Aug 2026US 2026/0239586 A1Valeo eAutomotive Germany GmbH
- Solder joint cooling system6 Aug 2026US 2026/0231319 A1Delta Electronics (Thailand) Public Co., Ltd.
- Semiconductor storage device, and semiconductor storage device manufacturing method30 Jul 2026US 2026/0223292 A1Kioxia Corporation
- Connection structure of wire and circuit board and temperature measurement unit23 Jul 2026US 2026/0213438 A1Autonetworks Technologies, Ltd.
Most cited
By later US patents
- Programmer1,483US 4,213,562 A1980
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991
- Lighting units429US 5,890,794 A1999
- Electrical connector having triad contact groups arranged in an alternating inverted sequence316US 6,350,134 B1Tyco Electronics Corporation · 2002
- Lead connections means for stacked tab packaged IC chips312US 5,138,438 AAkita Electronics Co., Ltd. · 1992