Semiconductor storage device, and semiconductor storage device manufacturing method
AssigneeKioxia Corporation
InventorsMasamichi YOKOMIZO, Daigo SUZUKI, Yasuyuki OHYAMA
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Abstract
A semiconductor storage device includes a substrate, a semiconductor memory provided on the substrate having a connecting portion, and an electronic part that has a main body that is disposed in the substrate, and a lead extending from the main body. A central axial line of the main body is aligned with a center of the substrate in a thickness direction of the substrate. The lead extends linearly and has a leading end that is fixed to the connecting portion and aligned with the connecting portion in a direction along which the lead extends from the main body.
Claims20
A semiconductor storage device, comprising:
- a substrate having a connecting portion;
- a semiconductor memory provided on the substrate;
- and
- an electronic part that has a main body that is disposed in the substrate, and a lead extending from the main body, wherein
- a central axial line of the main body is aligned with a center of the substrate in a thickness direction of the substrate, and
- the lead extends linearly and has a leading end that is fixed to the connecting portion and aligned with the connecting portion in a direction along which the lead extends from the main body.
A semiconductor storage device, comprising:
- a substrate having a first face, which extends in a first direction and a second direction perpendicular to the first direction, a second face, which is positioned on a side opposite to that of the first face, and a third face, wherein the third face extends from the first face to the second face in a third direction that is perpendicular to the first and second directions and is a thickness direction of the substrate, and has a connecting portion;
- a semiconductor memory provided on the first face;
- and
- an electronic part having a main body and a first lead that extends in the first direction from the main body, wherein
- a center in the third direction of the main body overlaps the third face when viewed along the first direction, and
- a leading end of the first lead is fixed to the connecting portion to face the connecting portion in the first direction.
A method of manufacturing a semiconductor storage device including a substrate, a semiconductor memory provided on the substrate, and an electronic part having a main body and a lead extending linearly from the main body, said method comprising:
- disposing the electronic part in an aperture formed through the substrate to align a central axial line of the main body with a center of the substrate in a thickness direction of the substrate;
- positioning a leading end of the lead to face a connecting portion formed on a side face of the substrate in a direction along which the lead extends from the main body;
- and
- fixing the lead to the connecting portion while the leading end of the lead is facing the connecting portion in the direction along which the lead extends from the main body.
Dependencies are inferred from the claim text.