H05K 3/346
Solder materials or compositions specially adapted therefor
H05K3/346 (Solder materials or compositions specially adapted therefor) appears on 747 US grants and 779 published applications in this corpus.
Search patents in H05K- Granted patents
- 747
- Published applications
- 779
- Assignees
- 337
- Inventors
- 1,753
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 3 | 0 |
| 1991 | 7 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 8 | 0 |
| 1995 | 12 | 0 |
| 1996 | 11 | 0 |
| 1997 | 13 | 0 |
| 1998 | 12 | 0 |
| 1999 | 24 | 0 |
| 2000 | 28 | 0 |
| 2001 | 36 | 14 |
| 2002 | 34 | 50 |
| 2003 | 40 | 53 |
| 2004 | 32 | 66 |
| 2005 | 30 | 46 |
| 2006 | 31 | 47 |
| 2007 | 35 | 60 |
| 2008 | 19 | 46 |
| 2009 | 31 | 45 |
| 2010 | 23 | 34 |
| 2011 | 27 | 23 |
| 2012 | 24 | 12 |
| 2013 | 16 | 17 |
| 2014 | 21 | 25 |
| 2015 | 19 | 29 |
| 2016 | 19 | 34 |
| 2017 | 28 | 20 |
| 2018 | 19 | 21 |
| 2019 | 27 | 22 |
| 2020 | 15 | 17 |
| 2021 | 13 | 16 |
| 2022 | 11 | 19 |
| 2023 | 18 | 22 |
| 2024 | 14 | 25 |
| 2025 | 8 | 11 |
| 2026 | 9 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Electronic component mounting structure and method for manufacturing same26 May 2026US 12,641,733 B2Murata Manufacturing Co., Ltd.
- Printed circuit board, battery module, battery pack, and electrical device5 May 2026US 12,620,635 B2Contemporary Amperex Technology (Hong Kong) Limited
- Flexible circuit board, display panel and method for manufacturing same, and display device21 Apr 2026US 12,610,456 B2Boe Technology Group Co., Ltd.
- Solder alloy, solder ball and solder joint24 Mar 2026US 12,583,060 B2Senju Metal Industry Co., Ltd.
- Power module and assembly method therefor16 Jul 2026US 2026/0206145 A1MetaPWR Electronics Co., Ltd.
- Electronic package and method for forming the same28 May 2026US 2026/0150199 A1JCET STATS ChipPAC Korea Limited
- Solder Alloy, Solder Ball, Solder Preform, Solder Joint, and Circuit30 Apr 2026US 2026/0115841 A1Senju Metal Industry Co., Ltd.
- Planar solder joint with diagonal trace for determining solder dimension to prevent electromigration5 Mar 2026US 2026/0068036 A1International Business Machines Corporation
- Method for mounting an electronic component in a printed circuit board, method for producing a multilayer printed circuit board and printed circuit board obtained by this method22 Jan 2026US 2026/0025931 A1
Most cited
By later US patents
- Thin stacked integrated circuit device208US 6,137,164 ATexas Instruments Incorporated · 2000
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997
- Method of securing metallic members together188US 4,727,633 ATektronix, Inc. · 1988
- Method of making components with solder balls162US 6,165,885 AInternational Business Machines Corporation · 2000
- Method of bumping substrates by contained paste deposition146US 5,539,153 AHewlett-Packard Company · 1996